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PIC16F73-E/SS 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
SSOP-28
描述:
PIC16F73/74/76/77 8 位闪存微控制器Microchip 的 PIC16F 系列微控制器 8 位 MCU，将 Microchip 的 PIC® 体系架构融入到引脚和封装选件中，从节省空间的 14 引脚设备到功能丰富的 64 引脚设备。 带有基线、中级或增强型中级体系架构的设备提供多种不同的外围设备组合，可谓设计人员提供灵活性，并为应用提供选择。 PIC16F73/74/76/77 系列微控制器基于 Microchip 的中级内核，带 8 层深硬件堆栈和 35 个指令。 这些 MCU 提供高达 5 个 MIP、14 千字节程序存储器和 368 字节 RAM。### 微控制器功能最大 20 MHz CPU 速度 35 指令 8 级硬件堆栈 22 个输入/输出引脚 – PIC16F73/76 型号 33 个输入/输出引脚 – PIC16F74/77 型号 通电重置 (POR) 通电计时器 (PWRT) 振荡器启动计时器 (OST) 掉电重置 (BOR) 监控器计时器 (WDT) 在线串行编程 (ICSP) 在线调试 (ICD) ### 外设8 位模拟到数字转换器 (ADC) - PIC16F73/76 5 通道、PIC16F74/77 8 通道 两个捕获、比较、PWM (CCP) 模块 两个 8 位计时器 一个 16 位计时器 同步串行端口 (SSP)，带有 SPI 和 I2C 通用同步异步接收器发射器 (USART)展开
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Date:
10 Jun 2016
Product Category:
Analog (Linear & Mixed Signal) AND Interface; 8-bit Microcontrollers; Analog (Thermal, Power
Management & Safety)
Notification subject:
CCB 1708 Cancellation Notice: For the qualification of CuPdAu bond wire and G700LS molding
compound in selected products of the 150K and 160K wafer technologies available in 28L SSOP
package at ANAP.
Notification text:
PCN Status:
Cancellation notification
Microchip Parts Affected:
This change would have affected selected products of the 150K and 160K wafer technologies available in 28L
SSOP package at ANAP assembly site.
Description of Change:
This qualification was originally presented to qualify palladium coated copper with gold flash (CuPdAu) bond wire
and G700LS molding compound in selected products of the 150K and 160K wafer technologies available in 28L
SSOP package at ANAP assembly site.
Impacts to Data Sheet:
Not Applicable
Reason for Change:
Microchip has decided not to qualify palladium coated copper with gold flash (CuPdAu) bond wire and G700LS
molding compound in selected products of the 150K and 160K wafer technologies available in 28L SSOP package
at ANAP assembly site.
Change Implementation Status:
Not Applicable
Estimated First Ship Date:
Not Applicable
Markings to Distinguish Revised from Unrevised Devices:
Not Applicable
Revision History:
July 30, 2015: Issued initial notification.
June 7, 2016: Issued cancellation notice for the qualification of palladium coated copper with gold flash (CuPdAu)
bond wire and G700LS molding compound in selected products of the 150K and 160K wafer technologies available
in 28L SSOP package at ANAP assembly site.
June 10, 2016: Updated reason for change.
Attachment(s):
PCN_JAON-21DZUH494_Affected_CPN.pdf
PCN_JAON-21DZUH494_Affected_CPN.xls
Please contact your local Microchip sales officewith questions or concerns regarding this notification.
Terms and Conditions:
If you wish to change your product/process change notification (PCN) profile please log on to our website at
http://www.microchip.com/PCN sign into myMICROCHIP to open the myMICROCHIP home page, then select a profile option from
the left navigation bar.
Product Change Notification - JAON-21DZUH494
Page 1 of 2Product Change Notification - JAON-21DZUH494 - 10 Jun 2016 - CCB 1708 Cancellati
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