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器件3D模型￥ 10.017
PIC16F73T-E/SS 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
8位微控制器
封装:
SSOP-28
Pictures:
3D模型
符号图
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页面导航:
型号编号列表在P3P4P5P6P7P8P9P10P11P12P13P14
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PIC16F73T-E/SS数据手册
Page:
of 28 Go
若手册格式错乱，请下载阅览PDF原文件
Date:
17 Nov 2017
Product Category:
16-Bit - Microcontrollers and Digital Signal Controllers; 32-bit PIC Microcontrollers; 8-bit PIC
Microcontrollers; Ethernet Controllers; Interface- Serial Peripherals; Interface- Controller Area Network
(CAN); Energy Measurement; Wireless Modules; Capacitive Touch Sensors
Notification subject:
CCB 3003 Final Notice: Qualification of MMT as an additional assembly site using gold (Au) bond wire
for selected products available in 28L SSOP package.
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MMT as an additional assembly site using gold (Au) bond wire for selected products
available in 28L SSOP package.
Pre Change:
Assembled at MTAI or ANAP assembly sites.
Post Change:
Assembled at MTAI or ANAP or MMT assembly sites.
Pre and Post Change Summary:
Pre Change Post Change
Assembly
Site
Microchip
Technology
Thailand - HQ
(MTAI)
Amkor
Philippines
(ANAP)
Microchip
Technology
Thailand - HQ
(MTAI)
Amkor
Philippines
(ANAP)
Microchip
Technology
Thailand –
Branch
(MMT)
Wire
material
Au Wire Au Wire Au Wire Au Wire Au Wire
Die attach
material
3280 8390A 8290 3280 8390A 8290 8390A
Molding
compound
material
G600 G600 G600 G600 G600
Lead
frame
material
CDA194 CDA194 CDA194 CDA194 CDA194
Impacts to Data Sheet:
None
Change Impact:
None
Product Change Notification - JAON-10GTAH636
Page 1 of 3Product Change Notification - JAON-10GTAH636 - 17 Nov 2017 - CCB 3003 Final Not
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-10GTA
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