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PIC16F84A-20I/SS 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
8位微控制器
封装:
SSOP-20
描述:
MICROCHIP PIC16F84A-20I/SS 微控制器, 8位, 闪存, PIC16F, 20 MHz, 1.75 KB, 68 Byte, 20 引脚, SSOP
Pictures:
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符号图
焊盘图
引脚图
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型号编号列表在P3P4P5P6P7P8P9P10P11P12P13P14
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PIC16F84A-20I/SS数据手册
Page:
of 37 Go
若手册格式错乱，请下载阅览PDF原文件
Date:
08 Mar 2018
Product Category:
8-bit PIC Microcontrollers; 16-Bit - Microcontrollers and Digital Signal Controllers; Ethernet Controllers;
Interface- Serial Peripherals; Wireless Modules; Capacitive Touch Sensors; Touch Controllers;
Interface- Infrared Products; USB Bridge
Notification subject:
CCB 3254 and CCB 3254.001 Initial Notice: Qualification of palladium coated copper with gold flash
(CuPdAu) bond wire in selected products available in 20L and 28L SSOP package at MTAI assembly
site
Notification text:
PCN Status:
Initial notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products
available in 20L and 28L SSOP package at MTAI assembly site
Pre Change:
Using palladium coated copper wire (PdCu) bond wire
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand
HQ (MTAI)
Microchip Technology
Thailand
HQ (MTAI)
Wire material PdCu Wire CuPdAu Wire
Die attach material 3280 3280
Molding compound
material
G600 G600
Lead frame material CDA194 CDA194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire
Product Change Notification - KSRA-01FYVO522
Page 1 of 2Product Change Notification - KSR
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