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PIC16F877AT-I/ML 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-44
描述:
PIC16 系列 368 B RAM 14 kB 闪存 8位 CMOS 微控制器 - QFN-44
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P3
导航目录
PIC16F877AT-I/ML数据手册
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of 15 Go
若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - LIAL-21VFOW015
Date:
26 Apr 2018
Product Category:
8-bit PIC Microcontrollers; Digital Potentiometers; Capacitive Touch Sensors; 16-Bit -
Microcontrollers and Digital Signal Controllers; Interface- Serial Peripherals
Affected CPNs:
Notification subject:
CCB 3219,3219.001-3219.005 Final Notice: Qualification of MMT as an additional site for
selected products of 150K and 160K wafer technologies available in 28L QFN-S,16L,20L,28L and
44L QFN packages
Notification text:
PCN Status:
Final notification. PCN
Type: Manufacturing
Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls)
Description of Change:
Qualification of MMT as an additional site for selected products of 150K and 160K wafer
technologies available in 44 QFN (8x8mm), 28L QFN-S(6x6mm), 28L QFN(6x6mm), 20L QFN
(4x4mm), 16L QFN((4x4mm) and 16L QFN(3x3mm) packages.
Pre Change:
Assembled at MTAI assembly site
Post Change:
Assembled at MTAI or MMT assembly site.
Pre and Post Change Summary:
Pre Change
Post Change
Assembly Site
Microchip Technology
Thailand HQ (MTAI).
Microchip Technology
Thailand HQ (MTAI).
Microchip Technology
Thailand Branch (MMT)
Wire material
CuPdAu
CuPdAu
Die attach material
3280
3280
Molding compound
material
G700LTD
G700LTD
Lead frame material
C194
C194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Change Implementation Status:
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