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PIC16F884-I/P
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PIC16F884-I/P数据手册
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Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve on time delivery performance by qualifying G600V as an addition/alternative mold
compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of
factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk
not having material to ship.
Change Implementation Status:
In Progress
Estimated First Ship Date:
April 30, 2020 (date code: 2018)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and
post change parts.
Time Table Summary:
April 2020
Workweek
14 15 16 17 18
Final PCN Issue Date X
Estimated Implementation Date
X
Method to Identify Change:
Traceability code
Qualification Plan:
Please open the attachments included with this PCN labeled as PCN_#_Qual_Plan.
Qualification Report:
Qualification Report will be available upon request.
Revision History:
April 13, 2020: Issued final notification.
The change described in this PCN does not alter Microchip's current regulatory compliance
regarding the material content of the applicable products.
Attachment(s):
PCN_GBNG-07ROAS851_Qual_Plan.pdf
Please contact your local Microchip sales office with questions or concerns regarding this
notification.
Terms and Conditions:
If you wish to receive Microchip PCNs via email please register for our PCN email service at our
PCN home page select register then fill in the required fields. You will find instructions about
registering for Microchips PCN email service in the PCN FAQ section.
If you wish to change your PCN profile, including opt out, please go to the PCN home page select
login and sign into your myMicrochip account. Select a profile option from the left navigation bar and
make the applicable selections.

PIC16F884-I/P 数据手册

Microchip(微芯)
328 页 / 5.15 MByte
Microchip(微芯)
137 页 / 5.82 MByte
Microchip(微芯)
40 页 / 6.76 MByte
Microchip(微芯)
322 页 / 4 MByte
Microchip(微芯)
24 页 / 0.47 MByte
Microchip(微芯)
120 页 / 0.32 MByte
Microchip(微芯)
4 页 / 0.15 MByte

PIC16F884 数据手册

Microchip(微芯)
MICROCHIP  PIC16F884-I/PT  微控制器, 8位, 闪存, AEC-Q100, PIC16F, 20 MHz, 7 KB, 256 Byte, 44 引脚, TQFP
Microchip(微芯)
PIC16F882/883/884/886/887 8 位闪存微控制器Microchip 的 PIC16F 系列微控制器 8 位 MCU,将 Microchip 的 PIC® 体系架构融入到引脚和封装选件中,从节省空间的 14 引脚设备到功能丰富的 64 引脚设备。 带有基线、中级或增强型中级体系架构的设备提供多种不同的外围设备组合,可谓设计人员提供灵活性,并为应用提供选择。 PIC16F882/883/884/886/887 系列微控制器基于 Microchip 的中级内核,带 8 层深硬件堆栈和 35 个指令。 这些 MCU 提供高达 5 个 MIP、14 千字节程序存储器、368 字节 RAM 和 256 字节 EEPROM。 板载是一个可配置振荡器,工厂校准到 ±1% 精确度。### 微控制器功能最大 20 MHz CPU 速度 35 指令 8 级硬件堆栈 8 MHz 内部振荡器 - 可选输出范围 8 MHz 至 31 kHz 24 个输入/输出引脚 –PIC16F882/883/886 35 个输入/输出引脚 –PIC16F884/887 通电重置 (POR) 掉电重置 (BOR) 通电计时器 (PWRT) 振荡器启动计时器 (OST) 监控器计时器 (WDT) 在线串行编程 (ICSP) 在线调试 (ICD) ### 外设10 位模拟到数字转换器 (ADC) - PIC16F882/883/886 11 通道,PIC16F884/887 14 通道 两个捕获、比较、PWM (CCP) 模块 增强型捕获、比较、PWM (ECCP) 模块 两个比较器 两个 8 位计时器 一个 16 位计时器 主同步串行端口 (MSSP),带有 SPI 和 I2C 增强型通用同步异步接收器发射器 (EUSART) ### PIC16 微控制器
Microchip(微芯)
PIC16 系列 256 B RAM 7 kB 闪存 8 位 CMOS 微控制器 - QFN-44
Microchip(微芯)
28 /40/ 44引脚,增强基于闪存的8位CMOS微控制器采用纳瓦技术 28/40/44-Pin, Enhanced Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology
Microchip(微芯)
28 /40/ 44引脚,增强基于闪存的8位CMOS微控制器采用纳瓦技术 28/40/44-Pin, Enhanced Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology
Microchip(微芯)
MICROCHIP  PIC16F884-I/ML  芯片, 微控制器, 8位, PIC16F, 20MHZ, QFN-44
Microchip(微芯)
28 /40/ 44引脚,增强基于闪存的8位CMOS微控制器采用纳瓦技术 28/40/44-Pin, Enhanced Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology
Microchip(微芯)
28 /40/ 44引脚,增强基于闪存的8位CMOS微控制器采用纳瓦技术 28/40/44-Pin, Enhanced Flash-Based 8-Bit CMOS Microcontrollers with nanoWatt Technology
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