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PIC16F913-I/SP 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
DIP-28
描述:
PIC16F913/914/916/917/946 8 位闪存微控制器Microchip 的 PIC16F 系列微控制器 8 位 MCU，将 Microchip 的 PIC® 体系架构融入到引脚和封装选件中，从节省空间的 14 引脚设备到功能丰富的 64 引脚设备。 带有基线、中级或增强型中级体系架构的设备提供多种不同的外围设备组合，可谓设计人员提供灵活性，并为应用提供选择。 PIC16F913/914/916/917/946 系列微控制器基于 Microchip 的中级内核，带 8 层深硬件堆栈和 35 个指令。 这些 MCU 提供高达 5 个 MIP、14 千字节程序存储器、352 字节 RAM 和 256 字节 EEPROM。 板载是一个可配置振荡器，工厂校准到 ±1% 精确度。### 微控制器功能最大 20 MHz CPU 速度 35 指令 8 级硬件堆栈 8 MHz 内部振荡器 - 可选输出范围 8 MHz 至 31 kHz 24 个输入/输出引脚 – PIC16F913/916 型号 35 个输入/输出引脚 – PIC16F914/917 型号 53 个输入/输出引脚 - 仅限 PIC16F946 型号 通电重置 (POR) 掉电重置 (BOR) 通电计时器 (PWRT) 振荡器启动计时器 (OST) 监控器计时器 (WDT) 可编程低电压检测 (PLVD) 在线串行编程 (ICSP) 在线调试 (ICD) ### 外设液晶显示屏 (LCD) 模块 - PIC16F913/916 60 段、PIC16F914/917 96 段、PIC16F946 168 段 10 位模拟到数字转换器 (ADC) - PIC16F913/916 5 通道，PIC16F914/917/946 8 通道 捕获、比较、PWM (CCP) 模块 - PIC16F913/916 x 1 模块、PIC16F914/917/946 x 2 模块 两个比较器 两个 8 位计时器 一个 16 位计时器 同步串行端口 (SSP)，带 I2C 可寻址通用同步异步接收器发送器 (AUSART)展开
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PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
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Date:
23 Aug 2013
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Analog (Linear & Mixed Signal) AND
Interface; 8-bit Microcontrollers; RF and Security; Analog (Thermal, Power Management & Safety);
Touch Sensing Technologies
Notification subject:
CCB 1155.05 Initial Notification: Qualification of selected products available in the 28L SPDIP, 8L
PDIP, and 18L PDIP packages with palladium coated copper (PdCu) bond wire at MTAI assembly
site.
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_CYER-09HJXI365_Affected_CPN.xls
PCN_CYER-09HJXI365_Affected_CPN.pdf
Description of Change:
Qualification of selected products available in the 28L SPDIP, 8L PDIP, and 18L PDIP packages with palladium
coated copper (PdCu) bond wire at MTAI assembly site.
NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the
affected CPN lists (attached) to identify the actual parts affected.
Pre Change:
Gold (Au) wire
Post Change:
Palladium coated copper (PdCu) bond wire
Impacts to Data Sheet:
None
Reason for Change:
To improve manufacturability
Change Implementation Status:
In progress
Estimated First Ship Dates:
October 18, 2013 (Date code: 1342)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
Traceability code
Revision History:
August 23, 2013: Initial notification issue date.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.
Attachment(s):
PCN_CYER-09HJXI365_Affected CPN.pdf
PCN_CYER-09HJXI365_Qual Plan.pdf
PCN_CYER-09HJXI365_Affected CPN.xlsx
Please contact your local Microchip sales officewith questions or concerns regarding this notification.
Terms and Conditions:
Product Change Notification - CYER-09HJXI365 (Printer Friendly)
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-09HJXI365 - 23 Aug 2013 - CCB 1155.05 Initial N...
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