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PIC18F23K20-E/ML 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-28
描述:
PIC18 8位 微控制器 带8 KB 闪存 采用28 引脚QFN封装
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应用领域在P1
型号编号列表在P3P4P5P6P7P8P9P10P11P12P13P14
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PIC18F23K20-E/ML数据手册
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PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND BUY ABOUT
US CONTACT US myMicrochip Login
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Date:
14 Dec 2016
Product Category:
SMSC; Touch Sensing Technologies; 8-bit Microcontrollers; 16-bit Microcontrollers and Digital
Signal Controllers
Notification subject:
CCB 2698.001-.005 Final Notice: Qualification of CuPdAu bond wire in selected products of the
200K wafer technology available in 44L QFN, 28L QFN-S, 28L QFN, 20L QFN and 16L QFN packages
at MTAI site
Notification text:
PCN Status:
Final notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of
the 200K wafer technology available in 44L QFN (8x8mm), 28L QFN-S (6x6mm), 28L QFN (6x6mm),
20L QFN (4x4mm), 16L QFN (4x4mm) and 16L QFN (3x3mm) packages at MTAI assembly site.
Pre Change:
Using gold (Au) bond wire
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MTAI MTAI
Wire material Au wire CuPdAu wire
Die attach material 3280 3280
Molding compound
material
G700LTD G700LTD
Lead frame material CDA194 CDA194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond
wire.
Product Change Notification - JAON-12WMVJ562
Page 1 of 3Product Change Notification - JAON-12WMVJ562 - 14 Dec 2016 - CCB 2698.001-.005 ...
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON-12WMV
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