Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC18F23K22-E/SO 数据手册 > PIC18F23K22-E/SO 其他数据使用手册 1/24 页
器件3D模型￥ 17.693
PIC18F23K22-E/SO 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
SOIC-28
描述:
28 /40/ 44引脚，低功耗，高性能的微控制器采用nanoWatt XLP技术 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P3
导航目录
PIC18F23K22-E/SO数据手册
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of 24 Go
若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - KSRA-01ZVUK607
Date:
16 Aug 2018
Product Category:
8-bit Microcontrollers; Development Tools; Touch Controllers; 16-Bit - Microcontrollers and Digital
Signal Controllers; Interface- Controller Area Network (CAN); Interface- Infrared Products; Interface-
Serial Peripherals; Ethernet Controllers
Affected CPNs:
Notification subject:
CCB 3217 and CCB 3217.001 Final Notice: Qualification of palladium coated copper with gold flash
(CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly
site
Notification text:
PCN Status:
Final notification
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products
available in 18L and 28L SOIC package at MTAI assembly site
Pre Change:
Using palladium coated copper wire (PdCu) bond wire
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand
(HQ) / MTAI
Microchip Technology
Thailand
(HQ) / MTAI
Wire material
PdCu Wire CuPdAu Wire
Die attach material
3280 3280
Molding compound
material
G600V G600V
Lead frame material
CDA194 CDA194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire
Change Implementation Status:
In Progress
Estimated First Ship Date:
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