Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC18F23K22-I/MV 数据手册 > PIC18F23K22-I/MV 产品修订记录 1/14 页
器件3D模型￥ 5.512
PIC18F23K22-I/MV 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
UQFN-28
描述:
28 /40/ 44引脚，低功耗，高性能的微控制器采用nanoWatt XLP技术 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with nanoWatt XLP Technology
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4
导航目录
PIC18F23K22-I/MV数据手册
Page:
of 14 Go
若手册格式错乱，请下载阅览PDF原文件
Page 1 of 3
Product Change Notification / GBNG-18IDVA860
Date:
10-Aug-2020
Product Category:
8-bit Microcontrollers, Capacitive Touch Sensors
PCN Type:
Manufacturing Change
Notification Subject:
CCB 4181, 4181.001 and 4181.002 Final Notice: Qualification of MMT as an additional assembly site
for selected products available in 40L (5x5x0.5mm), 28L (4x4x0.55mm) and 16L UQFN (4x4x0.5mm)
packages.
Affected CPNs:
GBNG-18IDVA860_Affected_CPN_08102020.pdf
GBNG-18IDVA860_Affected_CPN_08102020.csv
Notification Text:
PCN Status: Final notification.
PCN Type: Manufacturing Change
Microchip Parts Affected:Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change: Qualification of MMT as an additional assembly site for selected products available in 40L
(5x5x0.5mm), 28L (4x4x0.55mm) and 16L UQFN (4x4x0.5mm) packages.
Pre Change:
Assembled at NSEB assembly site.
Post Change:
Assembled at NSEB assembly site or assembled at MMT assembly site.
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