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器件3D模型￥ 61.65
PIC18F4455-I/P 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
8位微控制器
封装:
DIP-40
描述:
PIC18F2455/2550/4455/4550 8 位闪存微控制器### PIC18 微控制器
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4P5P144P145P146P152Hot
典型应用电路图在P199
原理图在P10P12P13P28P45P128P132P138P140P145P146P148
封装尺寸在P401
标记信息在P399P400
封装信息在P399
技术参数、封装参数在P187P371P372P373P374P377P378P379
应用领域在P156P278
电气规格在P9P91P266P267P271P272P275P285
导航目录
PIC18F4455-I/P数据手册
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PIC18F2455/2550/4455/4550
DS39632B-page 4 Preliminary 2004 Microchip Technology Inc.
Table of Contents
1.0 Device Overview ..........................................................................................................................................................................7
2.0 Oscillator Configurations............................................................................................................................................................ 23
3.0 Power-Managed Modes ............................................................................................................................................................. 35
4.0 Reset.......................................................................................................................................................................................... 43
5.0 Memory Organization................................................................................................................................................................. 57
6.0 Flash Program Memory.............................................................................................................................................................. 79
7.0 Data EEPROM Memory............................................................................................................................................................. 89
8.0 8 x 8 Hardware Multiplier............................................................................................................................................................ 95
9.0 Interrupts.................................................................................................................................................................................... 97
10.0 I/O Ports................................................................................................................................................................................... 111
11.0 Timer0 Module ......................................................................................................................................................................... 125
12.0 Timer1 Module ......................................................................................................................................................................... 129
13.0 Timer2 Module ......................................................................................................................................................................... 135
14.0 Timer3 Module ......................................................................................................................................................................... 137
15.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 141
16.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 149
17.0 Universal Serial Bus (USB)...................................................................................................................................................... 163
18.0 Streaming Parallel Port ............................................................................................................................................................ 187
19.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 193
20.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART)....................................................................................... 233
21.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 253
22.0 Comparator Module..................................................................................................................................................................263
23.0 Comparator Voltage Reference Module................................................................................................................................... 269
24.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 273
25.0 Special Features of the CPU.................................................................................................................................................... 279
26.0 Instruction Set Summary.......................................................................................................................................................... 301
27.0 Development Support............................................................................................................................................................... 351
28.0 Electrical Characteristics.......................................................................................................................................................... 357
29.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 395
30.0 Packaging Information.............................................................................................................................................................. 397
Appendix A: Revision History............................................................................................................................................................. 405
Appendix B: Device Differences......................................................................................................................................................... 405
Appendix C: Conversion Considerations ........................................................................................................................................... 406
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 406
Appendix E: Migration From Mid-Range to Enhanced Devices......................................................................................................... 407
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................407
Index .................................................................................................................................................................................................. 409
On-Line Support................................................................................................................................................................................. 421
Systems Information and Upgrade Hot Line...................................................................................................................................... 421
Reader Response.............................................................................................................................................................................. 422
PIC18F2455/2550/4455/4550 Product Identification System ............................................................................................................ 423
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