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PIC18F45K20-E/MV 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
UQFN-40
描述:
28 /40/ 44引脚闪存单片机采用纳瓦XLP技术 28/40/44-Pin Flash Microcontrollers with nanoWatt XLP Technology
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P3P4P5P6
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PIC18F45K20-E/MV数据手册
Page:
of 6 Go
若手册格式错乱，请下载阅览PDF原文件
Date:
30 Oct 2017
Product Category:
Notification subject:
CCB 3134 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond
wire in selected products for 200K wafer technology available in 40L UQFN package at NSEB
assembly site
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as
PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products
for 200K wafer technology available in 40L UQFN package at NSEB assembly site
Pre Change:
Using gold (Au) bond wire material.
Post Change:
Using palladium coated copper with gold flash (CuPdAu) bond wire material.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
UTAC Thai Limited LTD
(NSEB) Assembly Site
UTAC Thai Limited LTD
(NSEB) Assembly Site
Wire material Au Wire CuPdAu Wire
Die attach material
8600
8600
Molding compound
material
G700LTD G700LTD
Lead frame material EFTEC-64T EFTEC-64T
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve manufacturability and qualify CuPdAu bond wire at NSEB assembly site.
Change Implementation Status:
In Progress
Estimated Qualification Completion Date:
March 2018
Product Change Notification - KSRA-24QRXM272
Page 1 of 2Product Change Notification - KSR
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http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=KSR
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