Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC18F65K22T-I/MR 数据手册 > PIC18F65K22T-I/MR 其他数据使用手册 1/20 页
器件3D模型￥ 1.067
PIC18F65K22T-I/MR 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-64
描述:
PIC18F6xK22/8xK22 8 位闪存微控制器### PIC18 微控制器
Pictures:
3D模型
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PIC18F65K22T-I/MR数据手册
Page:
of 20 Go
若手册格式错乱，请下载阅览PDF原文件
Date:
16 Jan 2018
Product Category:
Capacitive Touch Sensors; 8-bit PIC Microcontrollers; USB Bridge; 16-Bit - Microcontrollers and Digital
Signal Controllers; USB Power Delivery
Notification subject:
CCB 3220,3220.001-3220.008 Initial Notice: Qualification of MMT as an additional assembly site for
selected products of 200K wafer technology available in 64L, 44L, 28L, 20L, and 16L QFN packages
Notification text:
PCN Status:
Initial notification.
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of MMT as an additional assembly site for selected product of 200K wafer technology
available in 64L, 44L, 28L, 20L and 16L QFN packages.
Pre Change:
Assembled at MTAI assembly site
Post Change:
Assembled at MTAI and MMT assembly site.
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site
Microchip Technology
Thailand HQ (MTAI).
Microchip Technology
Thailand HQ (MTAI)
Microchip
Technology
Thailand
Branch (MMT)
Wire material Au CuPdAu Au CuPdAu CuPdAu
Die attach material 3280 3280
Molding compound
material
G700LTD G700LTD
Lead frame material C194 C194
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Change Implementation Status:
In Progress
Product Change Notification - LIAL-02YNJF503
Page 1 of 2Product Change Notification - LIA
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-02YNJF503 - 16 Jan 2018 - CCB 3220,3220.001-3
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2018http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=LIA
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-02YNJF50
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