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PIC18F67J90T-I/PT 其他数据使用手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
TQFP-64
描述:
PIC 48MHz 闪存：64K@x16bit
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P3
导航目录
PIC18F67J90T-I/PT数据手册
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若手册格式错乱，请下载阅览PDF原文件
Product Change Notification - KSRA-20PIWE587
Date:
27 Mar 2018
Product Category:
16-Bit - Microcontrollers and Digital Signal Controllers; 8-bit PIC Microcontrollers; Ethernet
Controllers; 32-bit PIC Microcontrollers; Display A/D Converters
Affected CPNs:
Notification subject:
CCB 2970.002 Final Notice: Qualification of CuPdAu bond wire in selected products available in
64L and and 44L TQFP package at MTAI assembly site
Notification text:
PCN Status:
Final notification.
PCN Type:
Manufacturing Change
Microchip Parts Affected:
Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:
Qualification of CuPdAu bond wire in selected products available in 64L and 44L TQFP package
at MTAI assembly site
Pre Change:
Using palladium coated copper (PdCu) wire material
Post Change:
Using palladium coated copper wire with gold flash (CuPdAu) wire material
Pre and Post Change Summary:
Pre Change
Post Change
Assembly Site
Microchip Technology
Thailand (MTAI)
Microchip Technology Thailand
(MTAI)
Wire material
PdCu
CuPdAu
Die attach material
3280
3280
Molding compound material
G700HA
G700HA
Lead frame material
C7025
C7025
Impacts to Data Sheet:
None
Change Impact:
None
Reason for Change:
To improve manufacturability by qualifying CuPdAu bond wire at MTAI assembly site.
Change Implementation Status:
In Progress
Estimated First Ship Date:
April 27, 2018 (date code: 1817)
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