Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC18F67K22-I/MR 数据手册 > PIC18F67K22-I/MR 产品修订记录 1/3 页
器件3D模型￥ 39.316
PIC18F67K22-I/MR 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-64
描述:
MICROCHIP PIC18F67K22-I/MR 微控制器, 8位, 闪存, PIC18FxxKxx, 64 MHz, 128 KB, 4 KB, 64 引脚, QFN
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引脚图
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应用领域在P1P3
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PIC18F67K22-I/MR数据手册
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若手册格式错乱，请下载阅览PDF原文件
10/10/2016
ProductChangeNotificationJAON27DTJD58907Oct2016CCB2698FinalNotice:QualificationofCuPdAubondwireinselectedproductsofthe…
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON27DTJD589 1/3
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Date:
07 Oct 2016
Product Category:
8-bit Microcontrollers
Notication subject:
CCB 2698 Final Notice: Qualication of CuPdAu bond wire in selected
products of the 200K wafer technology available in 64L QFN
(9x9x0.9mm) package at MTAI assembly site.
Notication text:
PCNStatus:
Finalnotification
MicrochipPartsAffected:
Pleaseopentheattachmentsfoundintheattachmentsfieldbelowlabeledas
PCN_#_Affected_CPN.
NOTE:ForyourconvenienceMicrochipincludesidenticalfilesintwo
formats(.pdfand.xls).
DescriptionofChange:
Qualificationofpalladiumcoatedcopperwithgoldflash(CuPdAu)bondwire
inselectedproductsofthe200Kwafertechnologyavailablein64LQFN
(9x9x0.9mm)packageatMTAIassemblysite.
PreChange:
Usinggold(Au)bondwire
PostChange:
Usingpalladiumcoatedcopperwithgoldflash(CuPdAu)bondwire
PreandPostChangeSummary:
PreChange PostChange
AssemblySite MTAI MTAI
Wirematerial Auwire CuPdAuwire
Dieattachmaterial 3280 3280
Moldingcompound
material
G700LTD G700LTD
Leadframematerial CDA194 CDA194
ImpactstoDataSheet:
None
ChangeImpact:
Product Change Notication - JAON-27DTJD589 (Printer Friendly)
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