Datasheet 搜索 > 微控制器 > Microchip（微芯） > PIC32MX150F128B-I/ML 数据手册 > PIC32MX150F128B-I/ML 产品修订记录 1/15 页
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PIC32MX150F128B-I/ML 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-28
描述:
单片机(MCU/MPU/SOC) PIC32MX150F128B-I/ML QFN-28-EP(6x6)
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
型号编号列表在P4
导航目录
PIC32MX150F128B-I/ML数据手册
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of 15 Go
若手册格式错乱，请下载阅览PDF原文件
Page 1 of 3
Product Change Notification / JAON-28ACMH770
Date:
30-Jun-2020
Product Category:
16-Bit - Microcontrollers and Digital Signal Controllers,32-bit Microcontrollers,Capacitive Touch
Sensors,Ethernet Controllers,Sensor Fusion Hub
PCN Type:
Manufacturing Change
Notification Subject:
CCB 4156.001 and 4156.002 Final Notice: Qualification of palladium coated copper with gold flash
(CuPdAu) bond wire for selected products available in 44L QFN (8x8x0.9mm), 28L QFN-S (6x6x0.9mm)
and 28L QFN (6x6x0.9mm) packages at MTAI assembly site.
Affected CPNs:
JAON-28ACMH770_Affected_CPN_06302020.pdf
JAON-28ACMH770_Affected_CPN_06302020.csv
Notification Text:
PCN Status: Final notification
PCN Type: Manufacturing Change
Microchip Parts Affected:Please open one of the icons found in the Affected CPNs section above.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products
available in 44L QFN (8x8x0.9mm), 28L QFN-S (6x6x0.9mm) and 28L QFN (6x6x0.9mm) packages at MTAI assembly site.
Pre Change:
Using gold (Au) bond wire
Post Change:
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