Datasheet 搜索 > 接口芯片 > Microchip（微芯） > RE46C318E8F 数据手册 > RE46C318E8F 产品修订记录 1/3 页
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RE46C318E8F 产品修订记录 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
接口芯片
封装:
DIP-8
描述:
MICROCHIP RE46C318E8F 芯片, 喇叭驱动器, CMOS, 3V, PDIP-8
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RE46C318E8F数据手册
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PRODUCTS APPLICATIONS DESIGN SUPPORT TRAINING SAMPLE AND
BUY ABOUT US CONTACT US myMicrochip Login
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Date:
02 Mar 2016
Product Category:
Analog (Linear & Mixed Signal) AND Interface; Analog
(Thermal, Power Management & Safety)
Notification
subject:
CCB 2542 Initial Notice: Qualification of palladium coated
copper with gold flash (CuPdAu) bond wire for products
fabricated at XFGM available in 8L PDIP package at MMT
assembly site.
Notification text:
PCN Status:
Initial notification
Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled
as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip includes identical files in two
formats (.pdf and .xls).
Description of Change:
Qualification of palladium coated copper with gold flash (CuPdAu) bond
wire for products fabricated at XFGM available in 8L PDIP package at
MMT assembly site.
Pre Change:
Gold (Au) bond wire
Post Change:
Palladium coated copper with gold flash (CuPdAu) bond wire
Pre and Post Change Summary:
Pre Change Post Change
Assembly Site MMT assembly site MMT assembly site
Wire material Au wire CuPdAu wire
Die attach material CRM-1064L CRM-1064L
Product Change Notification - JAON-15JIKR494 (Printer
Friendly)
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Product Change Notification
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JAON
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15JIKR494
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02 Mar 2016
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CCB 2542 Initial Notic
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3/
3/
2016
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=JAON
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15JIKR494
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