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RS1MB-13-F 其他数据使用手册 - Multicomp
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RS1MB-13-F数据手册
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V1.025/02/13
Surface Mount Rectifier
Features:
• Low Prole Package
• For Surface Mounted Applications
• Built-In Strain Relief, Ideal for Automated Placement
• High Temperature Soldering: 250°C/10 seconds at Terminals
Mechanical Data
• Case : JEDEC DO-214AA, molded plastic over passivated chip
• Terminals : Solder plated, solderable per MIL-STD-750, method 2026
• Polarity : Colour band denotes cathode end
• Weight : 0.003oz, 0.093g
Maximum Ratings and Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specied
Note:
(1) Reverse recovery time test conditions: I
F=0.5A, IR=1A, Irr=0.25A
(2) Measured at 1MHz and applied reverse voltage of 4V
(3) Thermal resistance from junction to ambient and junction to lead PCB mounted on 0.2ʺ × 0.2ʺ (5 × 5mm
2
) copper pad areas
Characteristic Symbol RS1MB-13-F Units
Maximum repetitive peak reverse voltage V
RRM 1,000 V
Maximum RMS voltage V
RWS 700 V
Maximum DC blocking voltage V
DC 1,000 V
Maximum average forward rectied current at T
L=90°C IF(AV) 1 A
Peak forward surge current 8.3ms single half-sine-wave superimposed
on rated load
I
FSM 30 A
Maximum instantaneous forward voltage at 1A V
F 1.3 V
Maximum DC reverse current T
A=25°C
at rated DC blocking voltage TA=125°C
IR
5
50
μA
Typical reverse recovery time (Note1) t
rr 500 ns
Typical junction capacitance (Note 2) C
J 7 pF
Typical thermal resistance (Note 3)
R
θJA
RθJL
105
32
°C/W
Operating junction and storage temperature range T
J, TSTG -55 to +150 °C
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