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S1A-13-F
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  • 封装尺寸在P3
  • 焊盘布局在P3
  • 应用领域在P1
S1A-13-F数据手册
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V1.025/02/13
Surface Mount Rectifier
Features:
Optimized for Lan Protection Applications
Low Prole Package With Built-In Strain Relief For Surface Mounted Applications
Low Incremental Surge Resistance, Excellent Clamping Capability
400W Peak Pulse Power Capability With A 10/1,000Μs Wave Form, Repetition
Rate (Duty Cycle) : 0.01% (300W Above 78V)
Very Fast Response Time
High Temperature Soldering Guaranteed : 260°C/10 seconds at Terminals
Mechanical Data
Case : JEDEC SMA molded plastic over passivated chip
Terminals : Solder plated, solderable per MIL-STD-750, method 2026
Polarity : Colour band denotes cathode end
Weight : 0.002oz, 0.064g
Maximum Ratings and Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specied
Note:
(1) Measured at 1MHz and applied reverse voltage of 4V
(2) Thermal resistance from junction to ambient and junction to lead PCB mounted on 0.27ʺ × 0.27ʺ (7 × 7mm
2
) copper pad areas
Characteristic Symbol
S1A-
13-F
S1B-
13-F
S1D-
13-F
S1G-
13-F
S1J-
13-F
S1K-
13-F
S1M-
13-F
Units
Maximum repetitive peak reverse voltage V
RRM 50 100 200 400 600 800 1,000 V
Maximum RMS voltage V
RMS 35 70 140 280 420 560 700 V
Maximum DC blocking voltage V
DC 50 100 200 400 600 800 1,000 V
Maximum average forward rectied current
at T
L=110°C
IF(AV) 1 A
Peak forward surge current @ T
L = 110°C
8.3ms single half-sine-wave superimposed
on rated load(JEDEC Method)
IFSM 30 A
Maximum instantaneous forward voltage
at 1A
V
F 1.1 V
Maximum DC reverse current T
A=25°C
at rated DC blocking voltage TA=125°C
IR 1.05 μ A
Typical junction capacitance (Note 1) CJ 12 p F
Typical thermal resistance (Note 2) R
θJA 50 °C/W
Operating junction and storage temperature
range
T
J, TSTG -55 to +175 °C

S1A-13-F 数据手册

Multicomp
5 页 / 0.17 MByte
Multicomp
3 页 / 0.42 MByte

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