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S1AB-13-F
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S1AB-13-F数据手册
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S1A/B - S1M/B
1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
Features
Glass Passivated Die Construction
Low Forward Voltage Drop and High Current Capability
Surge Overload Rating to 30A Peak
Ideally Suited for Automated Assembly
Lead Free Finish/RoHS Compliant (Note 3)
Mechanical Data
Case: SMA/SMB
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Lead Free Plating (Matte Tin Finish).
Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
Marking: Type Number, See Page 3
Ordering Information: See Page 3
SMA Weight: 0.064 grams (approximate)
SMB Weight: 0.093 grams (approximate)
A
B
C
D
G
H
E
J
SMA SMB
Dim
Min Max Min Max
A 2.29 2.92 3.30 3.94
B 4.00 4.60 4.06 4.57
C 1.27 1.63 1.96 2.21
D 0.15 0.31 0.15 0.31
E 4.80 5.59 5.00 5.59
G 0.10 0.20 0.10 0.20
H 0.76 1.52 0.76 1.52
J 2.01 2.30 2.00 2.40
All Dimensions in mm
A, B, D, G, J, K, M Suffix Designates SMA Package
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
Maximum Ratings and Electrical Characteristics @T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic Symbol
S1
A/AB
S1
B/BB
S1
D/DB
S1
G/GB
S1
J/JB
S1
K/KB
S1
M/MB
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
50 100 200 400 600 800 1000 V
RMS Reverse Voltage
V
R(RMS)
35 70 140 280 420 560 700 V
Average Rectified Output Current @ T
T
= 100°C I
O
1.0 A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on rated load
I
FSM
30 A
Forward Voltage @ I
F
= 1.0A V
FM
1.1 V
Peak Reverse Leakage Current @ T
A
= 25°C
at Rated DC Blocking Voltage @ T
A
= 125°C
I
RM
5.0
100
μA
Maximum Reverse Recovery Time (Note 4)
t
rr
2.0
μs
Typical Total Capacitance (Note 1)
C
T
10
pF
Typical Thermal Resistance, Junction to Terminal (Note 2)
R
θJT
30
°C/W
Operating and Storage Temperature Range
T
j,
T
STG
-65 to +150
°C
Notes: 1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2. Thermal resistance junction to terminal, unit mounted on PC board with 5.0 mm
2
(0.013 mm thick) copper pads as heat sink.
3. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
4. Measured with I
F
= 0.5A, I
R
= 1.0A, I
RR
= 0.25A.
DS16003 Rev. 16 - 2 1 of 3
www.diodes.com
S1A/B – S1M/B
© Diodes Incorporated
SPICE MODEL: S1A S1B S1D S1G S1J S1K S1M S1AB
S1BB S1DB S1GB S1JB S1KB S1MB

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