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S3MB-13-F
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  • 封装尺寸在P3
  • 焊盘布局在P3
  • 应用领域在P1
S3MB-13-F数据手册
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V1.026/02/13
Surface Mount Rectifier
Features:
Plastic Package
For Surface Mounted Applications
Low Prole Package
Built-In Strain Relief, Ideal for Automated Placement
High Temperature Soldering : 250°C/10 seconds at Terminals
High Current Capability
Mechanical Data
Case : JEDEC DO-214AA molded plastic over passivated chip
Terminals : Solder plated, solderable per MIL-STD-750, method 2026
Polarity : Colour band denotes cathode end
Weight : 0.003oz, 0.093g
Maximum Ratings and Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specied
Note:
(1) Measured at 1MHz and applied reverse voltage of 4V
(2) Thermal resistance from junction to ambient and junction to lead PCB mounted on 0.27ʺ × 0.27ʺ (7 × 7mm
2
) copper pad areas
Characteristic Symbol S3DB-13-F S3GB-13-F S3MB-13-F Units
Maximum repetitive peak reverse voltage V
RRM 200 400 1,000 V
Maximum RMS voltage V
RWS 140 280 700 V
Maximum DC blocking voltage V
DC 200 400 1,000 V
Maximum average forward rectied current at T
L=90°C IF(AV) 3 A
Peak forward surge current at T
L = 110°C 8.3 ms single
half-sine-wave superimposed on rated load (JEDEC Method)
IFSM 100 A
Maximum Instantaneous Forward Voltage at 3A V
F 1.15 V
Maximum DC reverse current T
A=25°C
at rated DC blocking voltage T
A=100°C
I
R
10
100
μA
Typical junction capacitance (Note 1) C
J 35 pF
Typical thermal resistance (Note 2) R
θJA 40 °C/W
Operating junction and storage temperature range T
J, TSTG -55 to +150 °C

S3MB-13-F 数据手册

Multicomp
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Multicomp
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