Datasheet 搜索 > 微控制器 > ST Microelectronics（意法半导体） > STM32F100C6T6B 数据手册 > STM32F100C6T6B 产品修订记录 1/5 页
器件3D模型￥ 19.745
STM32F100C6T6B 产品修订记录 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
LQFP-48
描述:
STMICROELECTRONICS STM32F100C6T6B 微控制器, 32位, 线路接入, ARM 皮质-M3, 24 MHz, 32 KB, 4 KB, 48 引脚, LQFP
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STM32F100C6T6B数据手册
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PRODUCT / PROCESS CHANGE INFORMATION
1. PCI basic data
1.1 Company STMicroelectronics International N.V
1.2 PCI No. CRP/16/9871
1.3 Title of PCI Standardization of Inner Customized Label Size
1.4 Product Category Customized labels pasted on inner boxes
1.5 Issue date 2016-07-28
2. PCI Team
2.1 Contact supplier
2.1.1 Name MARSHALL DAVE
2.1.2 Phone
2.1.3 Email dave.marshall@st.com
2.2 Change responsibility
2.2.1 Process Owner Patrick LOW
2.1.2 Corporate Quality Manager Veronique LIVACHE
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
General (Logistic) Customized labelling ( inner or outer) Logistic site in LOYANG
4. Description of change
Old New
4.1 Description The Inner customized labels (ICL) which are
pasted on the inner boxes are using a label
format of 100mmx 75 mm with border lines
separating fields.
The Inner customized labels (ICL) which are
pasted on the inner boxes will be using a label
format of 90mm x 60 mm with no border lines
separating fields.
The sequence of information and fields remain
the same with respect of customer
specifications.
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
Form: No change on product
Fit: No change on product
Function: No change on product
5. Reason / motivation for change
5.1 Motivation Standardization of labels
Improvement of barcode printing quality
5.2 Customer Benefit LOGISTICS IMPROVEMENT
6. Marking of parts / traceability of change
6.1 Description At unpacking, customized label on inner box
7. Timing / schedule
7.1 Date of qualification results 2016-07-06
7.2 Intended start of delivery 2016-08-29
7.3 Qualification sample available? Upon Request
8. Qualification / Validation
8.1 Description
8.2 Qualification report and
qualification results
In progress Issue
Date
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