Web Analytics
Datasheet 搜索 > 微控制器 > ST Microelectronics(意法半导体) > STM32F100R6T6B 数据手册 > STM32F100R6T6B 产品修订记录 1/3 页
STM32F100R6T6B
器件3D模型
15.871
导航目录
  • 标记信息在P1
STM32F100R6T6B数据手册
Page:
of 3 Go
若手册格式错乱,请下载阅览PDF原文件
PRODUCT / PROCESS CHANGE NOTIFICATION
1. PCN basic data
1.1 Company STMicroelectronics International N.V
1.2 PCN No. MMS/16/9626
1.3 Title of PCN Additional capacity through High Density Matrix Leadframe in ST Muar (Malaysia) - STM32F100
128K and STM8L15x 64K products in LQFP 64 10x10 package
1.4 Product Category STM32F100 128K and STM8L15x 64K products in LQFP 64 10x10 package
1.5 Issue date 2016-02-16
2. PCN Team
2.1 Contact supplier
2.1.1 Name MATTE PIERRE
2.1.2 Phone +1 7814028596
2.1.3 Email pierre.matte@st.com
2.2 Change responsibility
2.2.1 Product Manager Michel BUFFA
2.1.2 Marketing Manager Daniel COLONNA
2.1.3 Quality Manager Pascal NARCHE
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
Transfer of a full process or process
brick (process step, control plan,
recipes) from one site to another site
Assembly site ST Muar (Malaysia), STATS ChipPAC Shanghai
(China), Amkor ATP (Philippines)
4. Description of change
Old New
4.1 Description The qualified assembly plants are ST Muar
(Malaysia), STATS ChipPAC Shanghai (China)
and Amkor ATP (Philippines).
The Bill of Materials is described in
PCN_9626_Additional information document.
To the current sources, we add an assembly
line in ST Muar (Malaysia) with High Density
Matrix leadframe. The Bill of Materials is
described in PCN_9626_Additional information
document.
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
no change
5. Reason / motivation for change
5.1 Motivation To increase assembly capacity on an existing line, already qualified, with High Density Matrix
leadframe.
5.2 Customer Benefit DOUBLE SOURCING
6. Marking of parts / traceability of change
6.1 Description See information in PCN_9626_Additional information document.
7. Timing / schedule
7.1 Date of qualification results 2016-04-15
7.2 Intended start of delivery 2016-05-15
7.3 Qualification sample available? Upon Request
8. Qualification / Validation
8.1 Description PCN_9626 - MCDRER1411 Reliability plan addendum ST Muar LQFP 10x10.pdf
8.2 Qualification report and
qualification results
Available (see attachment) Issue
Date
2016-02-16

STM32F100R6T6B 数据手册

ST Microelectronics(意法半导体)
95 页 / 1.51 MByte
ST Microelectronics(意法半导体)
27 页 / 0.21 MByte
ST Microelectronics(意法半导体)
156 页 / 4 MByte
ST Microelectronics(意法半导体)
230 页 / 3.11 MByte
ST Microelectronics(意法半导体)
34 页 / 0.57 MByte
ST Microelectronics(意法半导体)
6 页 / 0.09 MByte
ST Microelectronics(意法半导体)
3 页 / 0.04 MByte

STM32F100R6T6 数据手册

ST Microelectronics(意法半导体)
STMICROELECTRONICS  STM32F100R6T6B  芯片, 微控制器, 32位, ARM CORTEXM3, 24MHZ, 64-LQFP
ST Microelectronics(意法半导体)
STM32 系列 32 位 32 kB 闪存 4 kB RAM 基于 ARM 微控制器 - LQFP-64
器件 Datasheet 文档搜索
器件加载中...
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册,每天更新 5,000 多个 PDF 文件