Datasheet 搜索 > 微控制器 > ST Microelectronics（意法半导体） > STM32F100R8T7B 数据手册 > STM32F100R8T7B 产品修订记录 1/3 页
器件3D模型￥ 33.458
STM32F100R8T7B 产品修订记录 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
LQFP-64
描述:
STM32F100 超值系列微处理器，STMicroelectronicsSTM32F100 超值型基于 ARM Cortex™ M3 MCU，包含带电动机控制和 CEC 功能的 24 MHz CPU。 STM32 系列 ARM Cortex-M3 32 位闪存微控制器产品系列在低功率、低电压情况下运行，结合了带有实时功能的高性能。 它们为引脚到引脚接线并兼容软件。 STMicroelectronics 高级 ARM 32 位处理器低密度和中密度超值型带高达 512 KB 的闪存、计时器、ADC、DAC 和通信接口，还提供不同的封装。 ST 的 STM32F100 微控制器系列适用于多种区域，例如应用控制和用户接口；医疗和手持设备；PC 和游戏外设；GPS 平台和工业应用。 32 位 RISC；高达 512 KB 闪存；高达 32 KB SRAM 温度范围：- 40 至 +85 °C 低电压：2 V 至 3.6 V ### STM32F1 系列 32 位 ARM® Cortex®-M3 微控制器，STMicroelectronics32 位闪存微控制器的 STM32 系列基于 ARM Cortex™ M3 核心的突破 - 为嵌入式应用特别开发的核心。 STM32 系列得益于 Cortex-M3 体系结构增强功能，包括为传达改进性能而设置的 Thumb-2 指令，带更好的编码密度，对中断更快的反应，所有的均和领先的工业功耗相接合。出色的实时表现 卓越功效 卓越的和新型的外围设备 最大程度的集成 跨族引脚，外围设备和软件兼容性展开
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STM32F100R8T7B数据手册
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PRODUCT / PROCESS CHANGE NOTIFICATION
1. PCN basic data
1.1 Company STMicroelectronics International N.V
1.2 PCN No. MMS/16/9626
1.3 Title of PCN Additional capacity through High Density Matrix Leadframe in ST Muar (Malaysia) - STM32F100
128K and STM8L15x 64K products in LQFP 64 10x10 package
1.4 Product Category STM32F100 128K and STM8L15x 64K products in LQFP 64 10x10 package
1.5 Issue date 2016-02-16
2. PCN Team
2.1 Contact supplier
2.1.1 Name MATTE PIERRE
2.1.2 Phone +1 7814028596
2.1.3 Email pierre.matte@st.com
2.2 Change responsibility
2.2.1 Product Manager Michel BUFFA
2.1.2 Marketing Manager Daniel COLONNA
2.1.3 Quality Manager Pascal NARCHE
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
Transfer of a full process or process
brick (process step, control plan,
recipes) from one site to another site
Assembly site ST Muar (Malaysia), STATS ChipPAC Shanghai
(China), Amkor ATP (Philippines)
4. Description of change
Old New
4.1 Description The qualified assembly plants are ST Muar
(Malaysia), STATS ChipPAC Shanghai (China)
and Amkor ATP (Philippines).
The Bill of Materials is described in
PCN_9626_Additional information document.
To the current sources, we add an assembly
line in ST Muar (Malaysia) with High Density
Matrix leadframe. The Bill of Materials is
described in PCN_9626_Additional information
document.
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
no change
5. Reason / motivation for change
5.1 Motivation To increase assembly capacity on an existing line, already qualified, with High Density Matrix
leadframe.
5.2 Customer Benefit DOUBLE SOURCING
6. Marking of parts / traceability of change
6.1 Description See information in PCN_9626_Additional information document.
7. Timing / schedule
7.1 Date of qualification results 2016-04-15
7.2 Intended start of delivery 2016-05-15
7.3 Qualification sample available? Upon Request
8. Qualification / Validation
8.1 Description PCN_9626 - MCDRER1411 Reliability plan addendum ST Muar LQFP 10x10.pdf
8.2 Qualification report and
qualification results
Available (see attachment) Issue
Date
2016-02-16
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