Datasheet 搜索 > 32位控制器 > ST Microelectronics（意法半导体） > STM32F767NIH6 数据手册 > STM32F767NIH6 产品描述及参数 6/129 页
器件3D模型￥ 78.624
STM32F767NIH6 产品描述及参数 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
32位控制器
封装:
TFBGA-216
描述:
STMICROELECTRONICS STM32F767NIH6 微控制器, 32位, ART加速度器, ARM Cortex-M7, 216 MHz, 2 MB, 512 KB, 216 引脚, TFBGA 新
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P45P46P47P48P49P50P51P52P53P54P55P56Hot
封装尺寸在P100P101P102P103P104P105P106P107P108P109P110P111
型号编码规则在P27P125
标记信息在P102P105P109P113P117P120P123
导航目录
STM32F767NIH6数据手册
Page:
of 129 Go
若手册格式错乱，请下载阅览PDF原文件
List of figures STM32F767xx STM32F768Ax STM32F769xx
6/129 DocID027972 Rev 5
List of figures
Figure 1. Compatible board design for LQFP100 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 2. STM32F767xx, STM32F768Ax and STM32F769xx block diagram . . . . . . . . . . . . . . . . . 13
Figure 3. STM32F767xx, STM32F768Ax and STM32F769xx AXI-AHB bus matrix architecture
(1)
. . 16
Figure 4. Power supply supervisor interconnection with internal reset OFF . . . . . . . . . . . . . . . . . . . 22
Figure 5. PDR_ON control with internal reset OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 6. Regulator OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 7. Startup in regulator OFF: slow V
DD
slope
- power-down reset risen after V
CAP_1
/V
CAP_2
stabilization . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 8. Startup in regulator OFF mode: fast V
DD
slope
- power-down reset risen before V
CAP_1
/V
CAP_2
stabilization . . . . . . . . . . . . . . . . . . . . . . 26
Figure 9. STM32F767xx LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 10. STM32F767xx LQFP144 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 11. STM32F767xx LQFP176 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 12. STM32F769xx LQFP176 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 13. STM32F769xx/STM32F768Ax WLCSP180 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 14. STM32F767xx LQFP208 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 15. STM32F769xx LQFP208 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 16. STM32F767xx UFBGA176 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 17. STM32F767xx TFBGA216 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Figure 18. STM32F769xx TFBGA216 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Figure 19. Memory map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Figure 20. LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 100
Figure 21. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Figure 22. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package
top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Figure 23. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 103
Figure 24. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Figure 25. LQFP144, 20 x 20mm, 144-pin low-profile quad flat package
top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Figure 26. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 106
Figure 27. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
Figure 28. LQFP176, 24 x 24 mm, 176-pin low-profile quad flat package
top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Figure 29. WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Figure 30. WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Figure 31. WLCSP180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale package
top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Figure 32. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package outline . . . . . . . . . . . . . . . 114
Figure 33. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Figure 34. LQFP208, 28 x 28 mm, 208-pin low-profile quad flat package
top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Figure 35. UFBGA176+25, 10 × 10 × 0.65 mm ultra thin fine-pitch ball grid array
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
