Datasheet 搜索 > 微控制器 > ST Microelectronics（意法半导体） > STM32L053R6H6 数据手册 > STM32L053R6H6 其他数据使用手册 1/11 页
器件3D模型￥ 11.88
STM32L053R6H6 其他数据使用手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
TFBGA-64
描述:
STMICROELECTRONICS STM32L053R6H6 微控制器, 32位, 超低功率, ARM 皮质-M0+, 32 MHz, 32 KB, 8 KB, 64 引脚, TFBGA
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3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
标记信息在P1
应用领域在P3P5
型号编号列表在P4
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STM32L053R6H6数据手册
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若手册格式错乱，请下载阅览PDF原文件
PRODUCT / PROCESS CHANGE NOTIFICATION
1. PCN basic data
1.1 Company STMicroelectronics International N.V
1.2 PCN No. MMS/15/9201
1.3 Title of PCN Features improvement for STM32L05x & STM32L06x products - Amkor ATT (Taiwan) additional
source for products in WLCSP package
1.4 Product Category change 1: STM32L05x & STM32L06x products
change 2: STM32L05x products only in WLCSP package
1.5 Issue date 2015-04-27
2. PCN Team
2.1 Contact supplier
2.1.1 Name ROBERTSON HEATHER
2.1.2 Phone +1 8475853058
2.1.3 Email heather.robertson@st.com
2.2 Change responsibility
2.2.1 Product Manager Michel BUFFA
2.1.2 Marketing Manager Daniel COLONNA,Veronique BARLATIER
2.1.3 Quality Manager Pascal NARCHE
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
Die redesign Mask or mask set change with new die design change 1 : ST Rousset (France)
change 2 : Stats ChipPAC SCS (Singapore),
Amkor ATT (Taiwan)
4. Description of change
Old New
4.1 Description Limitations described in erratasheets (change
1)
Current back-end plant : Stats ChipPAC SCS
(Singapore)(change 2)
ST MCD Division is pleased to announce that
the features of the STM32L05x & STM32L06x
products listed below, will be enhanced
through the introduction of a new die revision
(change 1)
In addition, committed to serving our
customers, our teams operate with the
constant objective to improve customer
service through increased capacity and
additional sourcing, ST MCD Division will
qualify Amkor ATT (Taiwan) as additional back-
end plant for STM32L05x products only in
WLCSP package. (change 2).
Same technologies used in both sites.
See more details in annex1.
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
see in annex1
5. Reason / motivation for change
5.1 Motivation change 1 : QUALITY IMPROVEMENT - Correction of some limitations
change 2 : CAPACITY INCREASE - The change will improve and secure service through
capacity increased & additional sourcing.
5.2 Customer Benefit QUALITY IMPROVEMENT
6. Marking of parts / traceability of change
6.1 Description see in annex1
7. Timing / schedule
7.1 Date of qualification results 2015-06-24
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