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STM32L100RBT6A
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STM32L100RBT6A数据手册
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July 2016 DocID025707 Rev 4 1/24
TN1163
Technical note
Description of WLCSP for microcontrollers and
recommendations for its use
Introduction
This document describes the wafer level chip size package (WLCSP) and provides
recommendation on how to use it. Only WLCSP for microcontrollers are described herein.
The competitive market of portable equipment, in particular the mobile phone market, is
driven by the challenging development of highly integrated devices. To allow manufacturers
of portable equipment to minimize the dimension of their devices, STMicroelectronics has
developed WLCSP with reduced size, thickness and weight. The electrical performance of
such components is improved by using shorter connections than in standard plastic
packages such as TSSOP, SSOP or BGA.
The WLCSP family is designed to fulfill the same quality levels and same reliability
performance as standard semiconductor plastic packages. As a consequence these new
WLCSP can be considered as new surface mount devices which are assembled on a
printed circuit board (PCB) without any special or additional process steps. In particular
these packages do not require any extra underfill to increase reliability performance or to
protect the device. These packages are compatible with existing pick-and-place equipment
for board mounting. Only Lead-free RoHS compliant WLCSP are available in mass
production. The packages offered in WLCSP are listed in Table 1.
This document addresses the following topics:
Package description
Device marking
Packing specifications and labeling
Storage and shipping recommendations
Soldering assembly recommendations
Package changes and package quality
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STM32L100RBT6A 数据手册

ST Microelectronics(意法半导体)
102 页 / 1.57 MByte
ST Microelectronics(意法半导体)
43 页 / 2.79 MByte
ST Microelectronics(意法半导体)
911 页 / 12.99 MByte
ST Microelectronics(意法半导体)
283 页 / 3.42 MByte
ST Microelectronics(意法半导体)
24 页 / 1.06 MByte
ST Microelectronics(意法半导体)
16 页 / 0.81 MByte
ST Microelectronics(意法半导体)
3 页 / 0.04 MByte

STM32L100RBT6 数据手册

ST Microelectronics(意法半导体)
STMICROELECTRONICS  STM32L100RBT6  微控制器, 32位, ARM 皮质-M3, 32 MHz, 128 KB, 10 KB, 64 引脚, LQFP
ST Microelectronics(意法半导体)
STMICROELECTRONICS  STM32L100RBT6A  微控制器, 32位, 超低功率, ARM 皮质-M3, 32 MHz, 128 KB, 16 KB, 64 引脚, LQFP
ST Microelectronics(意法半导体)
STM32L 系列 128 KB 闪存 10 kB RAM 32-位 表面贴装 微控制器 - LQFP-64
ST Microelectronics(意法半导体)
STM32L100 系列微处理器,STMicroelectronicsSTMicroelectronics** STM32L 100 超值型**是一个超低功率 MCU ,带实时时钟、16位计时器、通信接口,例如 SPI、I2C、USART、USB、12 位 ADC 和 LCD 驱动器接口。 基于 ARM 的 Cortex 处理器入门级系列操作电源为 1.8 至 3.6 V,所有 STM32 L1 微控制器共享相同体系结构,带引脚到引脚兼容性。 闪存:64 Kb;SDRAM :8 Kb STM32 L1:动态电压比例;超低功耗时钟振荡器;LCD 驱动器(高达 8x28 段);比较器;DAC 和硬件加密 温度范围:- 40 至 +85°C ### STM32L1 系列 32 位 ARM® Cortex®-M3 微控制器,STMicroelectronics基于 ARM® Cortex™-M3 的 STM32 L1 系列采用 ST 专有超低泄漏工艺技术,具有创新自主的动态电压调节和五个 (5) 低功耗模式,提供了前所未有的平台灵活性以适用任何应用场合。 STM32 L1 系列延伸了超低功耗概念,同时不影响性能。超低功耗模式:300nA,带备份寄存器(3 个唤醒引脚) 超低功耗模式 + 实时时钟 (RTC):900nA,带备份寄存器(3 个唤醒引脚) 低功耗运行模式:低至 9μA 动态运行模式:低至 230μA/MHz
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