Datasheet 搜索 > 微控制器 > ST Microelectronics（意法半导体） > STM32L152CBT6 数据手册 > STM32L152CBT6 产品描述及参数 1/24 页
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STM32L152CBT6 产品描述及参数 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
LQFP-48
描述:
STM32L152 系列微处理器，STMicroelectronics超低功率 **STM32 L152** ARM ®Cortex®-M3 微控制器具有 ADC、DAC、比较器和计时器。 ARM Cortex-M3 32 位 RISC 内核处理器具有高性能 **STM32** 平台，工作频率为 32MHz，带集成 MPU、高速嵌入式闪存、RAM 和一系列外围设备。 此外，**STM32 L152** 包含 SPI、I²C、USART 和 USB 通信接口，它们还可提供电容性感应通道。 适用于多种应用，包括应用控制和用户界面、PC 外围设备、游戏、报警系统、实用计量、医疗设备、GPS 和手持设备。实时时钟 (RTC) 12 位 ADC 1MSPS 12 位 DAC 16 位和 32 位计时器 电源：1.8 V 至 3.6 V 温度范围：-40 °C 至 +85 °C LCD 控制器 ### STM32L1 系列 32 位 ARM® Cortex®-M3 微控制器，STMicroelectronics基于 ARM® Cortex™-M3 的 STM32 L1 系列采用 ST 专有超低泄漏工艺技术，具有创新自主的动态电压调节和五个 (5) 低功耗模式，提供了前所未有的平台灵活性以适用任何应用场合。 STM32 L1 系列延伸了超低功耗概念，同时不影响性能。超低功耗模式：300nA，带备份寄存器（3 个唤醒引脚） 超低功耗模式 + 实时时钟 (RTC)：900nA，带备份寄存器（3 个唤醒引脚） 低功耗运行模式：低至 9μA 动态运行模式：低至 230μA/MHz展开
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封装信息在P1P11P12P13P14P15P16
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STM32L152CBT6数据手册
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July 2016 DocID025707 Rev 4 1/24
TN1163
Technical note
Description of WLCSP for microcontrollers and
recommendations for its use
Introduction
This document describes the wafer level chip size package (WLCSP) and provides
recommendation on how to use it. Only WLCSP for microcontrollers are described herein.
The competitive market of portable equipment, in particular the mobile phone market, is
driven by the challenging development of highly integrated devices. To allow manufacturers
of portable equipment to minimize the dimension of their devices, STMicroelectronics has
developed WLCSP with reduced size, thickness and weight. The electrical performance of
such components is improved by using shorter connections than in standard plastic
packages such as TSSOP, SSOP or BGA.
The WLCSP family is designed to fulfill the same quality levels and same reliability
performance as standard semiconductor plastic packages. As a consequence these new
WLCSP can be considered as new surface mount devices which are assembled on a
printed circuit board (PCB) without any special or additional process steps. In particular
these packages do not require any extra underfill to increase reliability performance or to
protect the device. These packages are compatible with existing pick-and-place equipment
for board mounting. Only Lead-free RoHS compliant WLCSP are available in mass
production. The packages offered in WLCSP are listed in Table 1.
This document addresses the following topics:
• Package description
• Device marking
• Packing specifications and labeling
• Storage and shipping recommendations
• Soldering assembly recommendations
• Package changes and package quality
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