Datasheet 搜索 > 微控制器 > ST Microelectronics（意法半导体） > STM32L152VBT6A 数据手册 > STM32L152VBT6A 产品修订记录 1/3 页
器件3D模型￥ 30.354
STM32L152VBT6A 产品修订记录 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
LQFP-100
描述:
STM32L152 系列微处理器，STMicroelectronics超低功率 **STM32 L152** ARM ®Cortex®-M3 微控制器具有 ADC、DAC、比较器和计时器。 ARM Cortex-M3 32 位 RISC 内核处理器具有高性能 **STM32** 平台，工作频率为 32MHz，带集成 MPU、高速嵌入式闪存、RAM 和一系列外围设备。 此外，**STM32 L152** 包含 SPI、I²C、USART 和 USB 通信接口，它们还可提供电容性感应通道。 适用于多种应用，包括应用控制和用户界面、PC 外围设备、游戏、报警系统、实用计量、医疗设备、GPS 和手持设备。实时时钟 (RTC) 12 位 ADC 1MSPS 12 位 DAC 16 位和 32 位计时器 电源：1.8 V 至 3.6 V 温度范围：-40 °C 至 +85 °C LCD 控制器 ### STM32L1 系列 32 位 ARM® Cortex®-M3 微控制器，STMicroelectronics基于 ARM® Cortex™-M3 的 STM32 L1 系列采用 ST 专有超低泄漏工艺技术，具有创新自主的动态电压调节和五个 (5) 低功耗模式，提供了前所未有的平台灵活性以适用任何应用场合。 STM32 L1 系列延伸了超低功耗概念，同时不影响性能。超低功耗模式：300nA，带备份寄存器（3 个唤醒引脚） 超低功耗模式 + 实时时钟 (RTC)：900nA，带备份寄存器（3 个唤醒引脚） 低功耗运行模式：低至 9μA 动态运行模式：低至 230μA/MHz展开
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STM32L152VBT6A数据手册
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PRODUCT / PROCESS CHANGE NOTIFICATION
1. PCN basic data
1.1 Company STMicroelectronics International N.V
1.2 PCN No. MMS/15/9292
1.3 Title of PCN STM32L152V 128K STM32L162 384K STM32L162 512K - dice minor revision
1.4 Product Category STM32L1 128K Shrink & STM32L1 384K & STM32L1 512K dice. See full part number list in
9292_Detailed description document attached.
1.5 Issue date 2015-12-21
2. PCN Team
2.1 Contact supplier
2.1.1 Name MARSHALL DAVE
2.1.2 Phone
2.1.3 Email dave.marshall@st.com
2.2 Change responsibility
2.2.1 Product Manager Michel BUFFA
2.1.2 Marketing Manager Daniel COLONNA
2.1.3 Quality Manager Pascal NARCHE
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
Die redesign Mask or mask set change with new die design ST Rousset (France)
4. Description of change
Old New
4.1 Description Limitations described in erratasheets.
- Die STM32L1 128K Shrink : revision Z
Errata sheet Revision 6 for STM32L1xxx6/8/B-A
products
- Die STM32L1 384K : revision Y
Errata sheets : Revision 2 for
STM32L15xxD/C/C-A products, Revision 2 for
STM32L162xD/C/C-A products
- Die STM32L1 512K : revision A
Errata sheets : Revision 3 for STM32L15xxE
STM32L15xVD-X products, Revision 3 for
STM32L162xE STM32L162VD-X products
ST MCD Division is pleased to announce that
the features of STM32L152V 128K &
STM32L162 384K & STM32L162 512K
products, will be enhanced through the
introduction of new dice revisions.
- Die STM32L1 128K Shrink : Revision Y
Changes are described in Errata sheet
Revision 7 for STM32L1xxx6/8/B-A products
Wake up issues from stop and standby.
- Die STM32L1 384K : Revision X
Changes are described in Errata sheets :
Revision 3 for STM32L15xxD/C/C-A products,
Revision 3 for STM32L162xD/C/C-A products
Wake up issues from stop and standby.
- Die STM32L1 512K : Revision Z
Changes are described in Errata sheets :
Revision 4 for STM32L15xxE STM32L15xVD-X
products, Revision 4 for STM32L162xE
STM32L162VD-X products
Wake up issues from stop and standby.
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
Function : changes indicated in Errata sheets
5. Reason / motivation for change
5.1 Motivation The strategy of ST MCD Division is to increase the robustness and improve performances,
quality and functionality of our products. This is achieved by introducing new dice revisions for
STM32L152V 128K & STM32L162 384K & STM32L162 512K products.
5.2 Customer Benefit QUALITY IMPROVEMENT
6. Marking of parts / traceability of change
6.1 Description The dice revisions change, see table in 9292_Detailed description document attached. It is
marked onto the package of the part.
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