Datasheet 搜索 > ST Microelectronics（意法半导体） > STM32L496QGI6S 数据手册 > STM32L496QGI6S 其他数据使用手册 1/8 页
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STM32L496QGI6S 其他数据使用手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
封装:
UFBGA-132(7x7)
描述:
单片机(MCU/MPU/SOC) STM32L496QGI6S UFBGA-132
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STM32L496QGI6S数据手册
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PRODUCT / PROCESS CHANGE NOTIFICATION
1. PCN basic data
1.1 Company STMicroelectronics International N.V
1.2 PCN No. MDG/21/12542
1.3 Title of PCN AMKOR ATP (Philippines) enhanced Die Attach - All listed product in UFBGA package
1.4 Product Category All products in UFBGA 5x5, UFBGA 7x7 or UFBGA 10x10 packages
1.5 Issue date 2021-02-23
2. PCN Team
2.1 Contact supplier
2.1.1 Name ROBERTSON HEATHER
2.1.2 Phone +1 8475853058
2.1.3 Email heather.robertson@st.com
2.2 Change responsibility
2.2.1 Product Manager Ricardo Antonio DE SA EARP
2.1.2 Marketing Manager Veronique BARLATIER
2.1.3 Quality Manager Pascal NARCHE
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
Materials New direct material part number (same
supplier, different supplier or new supplier),
Die Attach material
AMKOR ATP (Philippines)
4. Description of change
Old New
4.1 Description Die Attach Film (DAF) material:
Henkel ATB-130U
Die Attach Film (DAF) material:
Nitto EM760L2-P
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
no impact
5. Reason / motivation for change
5.1 Motivation improve Die Attach fillet height condition
5.2 Customer Benefit QUALITY IMPROVEMENT
6. Marking of parts / traceability of change
6.1 Description Tracability ensured by ST internal tools
7. Timing / schedule
7.1 Date of qualification results 2021-02-10
7.2 Intended start of delivery 2021-04-02
7.3 Qualification sample available? Upon Request
8. Qualification / Validation
8.1 Description 12542 MDG-MCD-RER2020 V1.0-PCN12542-AMKOR ATP enhanced Die Attach UFBGA.pdf
8.2 Qualification report and
qualification results
Available (see attachment) Issue
Date
2021-02-23
9. Attachments (additional documentations)
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