Datasheet 搜索 > 微控制器 > ST Microelectronics（意法半导体） > STM8S005C6T6 数据手册 > STM8S005C6T6 产品修订记录 1/3 页
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STM8S005C6T6 产品修订记录 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
LQFP-48
描述:
STM8S 8 位微控制器，STMicroelectronicsSTM8S 系列通用 8 位闪存微控制器是具有一个 3 级管线的 STM8 的高级芯型号。 STM8S 受益于在 24MHz 在操作高达 20MIPS 的高级芯体系架构。 嵌入式 EEPROM、RC 振荡器和完整的外围设备为设计人员提供坚固且可靠的解决方案。 ### STM8 8 位微控制器，STMicroelectronicsSTM8 平台已应用于高性能 8 位核心且是最先进的外围设备。 8 位微控制器以 16/24MHz 操作，具有高达 128kB 闪存、内部 RAM 和 EEPROM、8/16 位计时器、A/D 转换器、D/A 转换器、比较器、串行接口和可选显示控制器。
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STM8S005C6T6数据手册
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PRODUCT / PROCESS CHANGE NOTIFICATION
1. PCN basic data
1.1 Company STMicroelectronics International N.V
1.2 PCN No. MDG/20/12050
1.3 Title of PCN JSCC capacity increase - for listed products
1.4 Product Category STM8, STM32
1.5 Issue date 2020-03-10
2. PCN Team
2.1 Contact supplier
2.1.1 Name FRANK SCHIFANO
2.1.2 Phone +1 5148333778
2.1.3 Email frank.schifano@st.com
2.2 Change responsibility
2.2.1 Product Manager Ricardo Antonio DE SA EARP
2.1.2 Marketing Manager Veronique BARLATIER
2.1.3 Quality Manager Pascal NARCHE
3. Change
3.1 Category 3.2 Type of change 3.3 Manufacturing Location
Materials New direct material part number (same
supplier, different supplier or new supplier),
Bond wire material, diameter
StatsChipPAC JSCC Jiangyin China
4. Description of change
Old New
4.1 Description Silver wire bonding Silver wire bonding
Gold wire bonding
4.2 Anticipated Impact on form,fit,
function, quality, reliability or
processability?
No impact
5. Reason / motivation for change
5.1 Motivation Capacity and flexibility increase to support customer growing demand
5.2 Customer Benefit CAPACITY INCREASE
6. Marking of parts / traceability of change
6.1 Description Traceability of the change is ensured by ST internal tools.
7. Timing / schedule
7.1 Date of qualification results 2020-06-12
7.2 Intended start of delivery 2020-06-12
7.3 Qualification sample available? Upon Request
8. Qualification / Validation
8.1 Description 12050 RERMCD2005 - JSCC Capacity increase- PCN12050 reliability plan.pdf
8.2 Qualification report and
qualification results
Available (see attachment) Issue
Date
2020-03-10
9. Attachments (additional documentations)
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