Datasheet 搜索 > 微控制器 > ST Microelectronics（意法半导体） > STM8S207K6T3C 数据手册 > STM8S207K6T3C 产品描述及参数 1/24 页
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STM8S207K6T3C 产品描述及参数 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
微控制器
封装:
LQFP-32
描述:
STM8S 8 位微控制器，STMicroelectronicsSTM8S 系列通用 8 位闪存微控制器是具有一个 3 级管线的 STM8 的高级芯型号。 STM8S 受益于在 24MHz 在操作高达 20MIPS 的高级芯体系架构。 嵌入式 EEPROM、RC 振荡器和完整的外围设备为设计人员提供坚固且可靠的解决方案。 ### STM8 8 位微控制器，STMicroelectronicsSTM8 平台已应用于高性能 8 位核心且是最先进的外围设备。 8 位微控制器以 16/24MHz 操作，具有高达 128kB 闪存、内部 RAM 和 EEPROM、8/16 位计时器、A/D 转换器、D/A 转换器、比较器、串行接口和可选显示控制器。
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STM8S207K6T3C数据手册
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July 2016 DocID025707 Rev 4 1/24
TN1163
Technical note
Description of WLCSP for microcontrollers and
recommendations for its use
Introduction
This document describes the wafer level chip size package (WLCSP) and provides
recommendation on how to use it. Only WLCSP for microcontrollers are described herein.
The competitive market of portable equipment, in particular the mobile phone market, is
driven by the challenging development of highly integrated devices. To allow manufacturers
of portable equipment to minimize the dimension of their devices, STMicroelectronics has
developed WLCSP with reduced size, thickness and weight. The electrical performance of
such components is improved by using shorter connections than in standard plastic
packages such as TSSOP, SSOP or BGA.
The WLCSP family is designed to fulfill the same quality levels and same reliability
performance as standard semiconductor plastic packages. As a consequence these new
WLCSP can be considered as new surface mount devices which are assembled on a
printed circuit board (PCB) without any special or additional process steps. In particular
these packages do not require any extra underfill to increase reliability performance or to
protect the device. These packages are compatible with existing pick-and-place equipment
for board mounting. Only Lead-free RoHS compliant WLCSP are available in mass
production. The packages offered in WLCSP are listed in Table 1.
This document addresses the following topics:
• Package description
• Device marking
• Packing specifications and labeling
• Storage and shipping recommendations
• Soldering assembly recommendations
• Package changes and package quality
www.st.com
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