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TC1411EOA
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TC1411EOA数据手册
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Product Change Notification / JAON-04IGFH099
Date:
09-Feb-2021
Product Category:
Power MOSFET Drivers
PCN Type:
Manufacturing Change
Notification Subject:
CCB 4542 Initial Notice: Qualification of a new lead frame design for selected products available in 8L
SOIC package using 8900NC die attach and gold (Au) bond wire material assembled at MMT assembly
site.
Affected CPNs:
JAON-04IGFH099_Affected_CPN_02092021.pdf
JAON-04IGFH099_Affected_CPN_02092021.csv
Notification Text:
PCN Status: Initial notification
PCN Type: Manufacturing Change
Microchip Parts Affected:Please open one of the files found in the Affected CPNs section.
NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).
Description of Change:Qualification of a new lead frame design for selected products available in 8L SOIC package using
8900NC die attach and gold (Au) bond wire material assembled at MMT assembly site.
Pre Change:
Using lead frame without lead lock
Post Change:
Using lead frame with lead lock

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