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TE28F320B3BA100 其他数据使用手册 - Intel（英特尔）
制造商:
Intel（英特尔）
分类:
主动器件
封装:
TSOP
Pictures:
3D模型
符号图
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引脚图
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TE28F320B3BA100数据手册
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Intel
£
Advanced Boot Block Flash
Memory (B3)
28F008/800B3, 28F016/160B3, 28F320B3, 28F640B3
Datasheet
Product Features
The Intel
®
Advanced Boot Block Flash Memory (B3) device, manufactured on Intel’s latest 0.13
µm and 0.18 µm technologies, represents a feature-rich solution at overall lower system cost.
The B3 device in x16 will be available in 48-lead TSOP and 48-ball CSP packages. The x8
option of this product family is available only in 40-lead TSOP and 48-ball µBGA* packages.
Additional information on this product family can be obtained by accessing Intel’s website at:
http://www.intel.com/design/flash.
• Flexible SmartVoltage Technology
—2.7 V–3.6 V Read/Program/Erase
—12 V V
PP
Fast Production Programming
• 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option
— Reduces Overall System Power
• High Performance
—2.7 V–3.6 V: 70 ns Max Access Time
• Optimized Block Sizes
—Eight 8-KB Blocks for Data,Top or
Bottom Locations
—Up to One Hundred Twenty-Seven 64-
KB Blocks for Code
• Block Locking
—V
CC
-Level Control through WP#
• Low Power Consumption
—9 mA Typical Read Current
• Absolute Hardware-Protection
—V
PP
= GND Option
—V
CC
Lockout Voltage
• Extended Temperature Operation
—–40 °C to +85 °C
• Automated Program and Block Erase
—Status Registers
• Intel
®
Flash Data Integrator Software
—Flash Memory Manager
—System Interrupt Manager
—Supports Parameter Storage, Streaming
Data (e.g., Voice)
• Extended Cycling Capability
—Minimum 100,000 Block Erase Cycles
Guaranteed
• Automatic Power Savings Feature
—Typical I
CCS
after Bus Inactivity
• Standard Surface Mount Packaging
—48-Ball CSP Packages
—40- and 48-Lead TSOP Packages
• Density and Footprint Upgradeable for
common package
—8-, 16-, 32- and 64-Mbit Densities
• ETOX™ VIII (0.13 µm) Flash
Technology
—16 and 32-Mbit Densities
• ETOX™ VII (0.18 µm) Flash Technology
—16-, 32- and 64-Mbit Densities
• ETOX ™ VI (0.25µm) Flash Technology
—8-, 16-, and 32-Mbit Densities
• The x8 option not recommended for new
designs
Order Number: 290580-017
May 2003
Notice: This specification is subject to change without notice. Verify with your local Intel sales
office that you have the latest datasheet before finalizing a design.
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