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TIP142TTU 其他数据使用手册 - ON Semiconductor(安森美)
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ON Semiconductor(安森美)
分类:
双极性晶体管
封装:
TO-220-3
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TIP142TTU数据手册
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Final Product/Process Change Notification
Document #:FPCN22647XX
Issue Date:09 Apr 2020
NOTE: Fortheperiodof10/1/2019through1/10/2020,duetoadatairregularityinthecustomerimpactlists,someindirectsalescustomersmay
nothavereceivedproductchange,productdiscontinuance,orproductbulletinnoticesasexpectedthroughemail.Althoughthesenotificationswere
published on our public portal (https://www.onsemi.com/PowerSolutions/pcnPub.do), ON Semiconductor is taking the action to redistribute
affectednotices,withrevisedimplementationdatesconformingtoexternalstandardsandONSemiconductor’scustomernotificationpolicies.This
issuehasbeenresolved.QuestionsrelatedtothisissuecanbedirectedtoPCN.Support@onsemi.com
TEM001793 Rev. C Page 1 of 10
TitleofChange:
RedistributionofFPCN22647XJ(1stSplit)‐MoldCompoundChangeattributedtoanEndofLifeof
SamsungSDIEMCforproductsinTO‐220package.
ProposedFirstShipdate:
16Jul2020orearlierifapprovedbycustomer
ContactInformation:
ContactyourlocalONSemiconductorSalesOfficeorPCN.Support@onsemi.com
PCNSamplesContact:
ContactyourlocalONSemiconductorSalesOfficeorPCN.samples@onsemi.com;
<Bokyun.Seo@onsemi.com>;<Sariman.T@onsemi.com>;<JinMan.Song@onsemi.com>;
<David.Zhu@onsemi.com>;<Raja.Roziah.Rahmat@onsemi.com>;<CheePin.Tay@onsemi.com>;
<Khairil.FK@onsemi.com>
Samplerequestsaretobesubmittednolaterthan30daysfromthedateoffirstnotification,
InitialPCNorFinalPCN,forthischange.
Samplesdeliverytimingwillbesubjecttorequestdate,samplequantityandspecialcustomer
packing/labelrequirements.
AdditionalReliabilityData:
ContactyourlocalONSemiconductorSalesOfficeorLake.Wang@onsemi.com
TypeofNotification:
ThisisaFinalProduct/ProcessChangeNotification(FPCN)senttocustomers.FPCNsareissued90
dayspriortoimplementationofthechange.
ONSemiconductorwillconsiderthischangeaccepted,unlessaninquiryismadeinwritingwithin
30daysofdeliveryofthisnotice.Todoso,contactPCN.Support@onsemi.com
MarkingofParts/Traceabilityof
Change:
Productwithdatecode1949ornewerwillbeassembledwiththenewmoldcompound.
ChangeCategory:
AssemblyChange
ChangeSub‐Category(s):
MaterialChange
SitesAffected:
ONSemiconductorSites ExternalFoundry/SubconSites
ONSemiconductorSuzhou,China None
DescriptionandPurpose:
ONSemiconductorwishestoinformourcustomersofachangeinmoldcompoundsusedforthedeviceslistedinthisPCN.Thischangeisaresult
ofanEndofLifenotificationreceivedfromSamsungforseveraloftheirSDIMoldCompounds.
DuetothediscontinuanceoftheSDImold compounds, ON Semiconductorwill onlyhavelimitedsupplies of theexistingmaterialandinsome
casesthismaynotallowforthenormalchangenotificationperiod.
Allotheraspectsoftheimpactedproducts(form,fit,function)willremainunchanged.
BeforeChangeDescription AfterChangeDescription
MoldCompound SI7200DX2;Supplier:SamsungSDI KTMC1050GFB,Supplier:KCC
MoldCompound SG8200DL;Supplier:SamsungSDI KTMC1050GFB,Supplier:KCC
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