Datasheet 搜索 > LIN芯片 > NXP（恩智浦） > TJA1021TK/10/C,118 数据手册 > TJA1021TK/10/C,118 其他数据使用手册 1/6 页
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TJA1021TK/10/C,118 其他数据使用手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
LIN芯片
封装:
HVSON-8
描述:
NXP TJA1021TK/10/C,118 芯片, LIN 收发器, AEC-Q100, HVSON-8 新
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P1P2P3P4P5
焊接温度在P1P4
导航目录
TJA1021TK/10/C,118数据手册
Page:
of 6 Go
若手册格式错乱，请下载阅览PDF原文件
S
O
8
SOT96-1
plastic, small outline package; 8 terminals; 1.27 mm pitch; 4.9
mm x 3.9 mm x 1.75 mm body
9 January 2017 Package information
1. Package summary
Dimensions (mm) 4.9 x 3.9 x 1.75
Terminal position code D (double)
Package type descriptive code SO8
Package outline version code SOT96-1
Manufacturer package code SOT96
Package type industry code SO8
Package outline version description plastic, small outline package; 8 terminals; 1.27
mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body
Package style descriptive code SO (small outline)
Package body material type P
IEC package outline code 076E03
JEDEC package outline code MS-012
Handling precautions IC26_CHAPTER_3_2000
Thermal design considerations IC26_CHAPTER_6_2000
Mounting method type S (surface mount)
Generic mounting and soldering information AN10365_3
Reflow soldering footprint SO-SOJ-REFLOW
Wave soldering footprint SO-SOJ-WAVE
Package life cycle status REL
Major version date 18-9-2008
Minor version date 14-5-2012
Security status COMPANY PUBLIC
Modified date 23-10-2012
Issue date 18-2-2003
Web publication date 28-11-2012
Initial web publication date 11-3-2011
Customer specific indicator N
Maturity Product
Package author Nair Deepa
Package approver Nair Deepa
Table 1. Package summary
Symbol Parameter Min Typ Nom Max Unit
A
2
package height 1.25 - 1.35 1.45 mm
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