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TL052AIDR 其他数据使用手册 - TI（德州仪器）
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TI（德州仪器）
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运算放大器
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SOIC-8
描述:
增强型JFET低偏移运算放大器 ENHANCED-JFET LOW-OFFSET OPERATIONAL AMPLIFIERS
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TL052AIDR数据手册
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Texas Instruments, Inc. PCN#20170112001
PCN Number:
20170112001
PCN Date:
Jan 16 2017
Title:
Die Coating change for Select Devices
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
April 16 2017
Estimated Sample
Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
This notification is to announce the change in die coat material set for the 2 groups of devices
noted below as follows:
Group 1 Devices
Current
Proposed
Die Overcoat
No Die overcoat
Group 2 Devices:
Current
Proposed
Polyimide Overcoat
PBO overcoat
Reason for Change:
Group 1: Die Coat not needed with Current Material Set
Group 2: Move to standardized material set
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Anticipated impact on Material Declaration
No Impact to the
Material Declaration
Material Declarations or Product Content reports are driven from
production data and will be available following the production
release. Upon production release the revised reports can be
obtained from the TI ECO website.
Changes to product identification resulting from this PCN:
None
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