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TLC27M7CP 其他数据使用手册 - TI（德州仪器）
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TLC27M7CP数据手册
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Texas Instruments, Inc. PCN# 20120223003A
PCN Number:
20120223003A
PCN Date:
12/04/2013
Title:
Add Cu as Alternative Bond Wire Metal for Select Devices
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality Services
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Revision A is to remove select devices in the Product Affected: 0.96 Mil Cu Bond Wire Option
(with strikethrough) and highlighted in yellow. These devices were inadvertently added and not
affected by this change.
Qualification of Cu bond wire option for select devices in the BGA, TSSOP, QFN, QFP and PDIP
packages. See table below.
Current Bond Wire (Au)
Additional Bond wire option (Cu)
Wire diameter (mils)
0.7, 0.8, 0.9, 0.96, 1.0,
1.15, 1.2, 1.31, 1.97, 1.98,
0.8, 0.96, 1.3, 2.0 Mil Dia.
The devices in the product Affected list (grouped by wire diameter) are being
qualified by similarity. These package qualifications and devices in these package
families have been covered in prior PCNs, primarily PCN 20101215001 and PCN
20110919000. The purpose of this PCN is to convert additional devices in the same
package families to Cu wire.
A summary of the Reference Qualifications are shown in the table below.
Reference Qualification #
Cu Wire Diameter / Pkg Type
1
0.8 mils / TSSOP
2
0.96 mils / TSSOP
3
1.3 mils/ TSSOP
4
2.0 mils / TSSOP
5
0.8 mils / QFP
6
0.96 mils / QFP
7
0.8 mils / QFN
8
0.96 mils / QFN
9
1.3 mils / QFN
10
2.0 mils / QFN
11
0.8 mils / BGA
12
0.96 mils / BGA
13
0.96 mils / PDIP
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