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TMP100 产品封装文件 - TI（德州仪器）
制造商:
TI（德州仪器）
封装:
SOT-23-6
描述:
具有 I2C/SMBus 接口的 ±1°C 温度传感器
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P19P20
原理图在P1P8
封装尺寸在P24P26P27
标记信息在P24P25
封装信息在P23P24P25P26P27
技术参数、封装参数在P4
应用领域在P1P21P25P30
电气规格在P5
导航目录
TMP100数据手册
Page:
of 30 Go
若手册格式错乱，请下载阅览PDF原文件
TMP100
,
TMP101
SBOS231I –JANUARY 2002–REVISED NOVEMBER 2015
www.ti.com
Table of Contents
7.3 Feature Description................................................... 9
1 Features.................................................................. 1
7.4 Device Functional Modes........................................ 14
2 Applications ........................................................... 1
7.5 Programming........................................................... 15
3 Description............................................................. 1
8 Application and Implementation ........................ 19
4 Revision History..................................................... 2
8.1 Application Information............................................ 19
5 Pin Configuration and Functions......................... 3
8.2 Typical Application.................................................. 19
6 Specifications......................................................... 4
9 Power Supply Recommendations...................... 21
6.1 Absolute Maximum Ratings...................................... 4
10 Layout................................................................... 21
6.2 ESD Ratings ............................................................ 4
10.1 Layout Guidelines ................................................. 21
6.3 Recommended Operating Conditions....................... 4
10.2 Layout Examples................................................... 21
6.4 Thermal Information ................................................. 4
11 Device and Documentation Support................. 23
6.5 Electrical Characteristics........................................... 5
11.1 Related Links ........................................................ 23
6.6 Timing Requirements................................................ 6
11.2 Trademarks........................................................... 23
6.7 Typical Characteristics.............................................. 7
11.3 Electrostatic Discharge Caution............................ 23
7 Detailed Description.............................................. 8
11.4 Glossary................................................................ 23
7.1 Overview................................................................... 8
12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram......................................... 8
Information........................................................... 23
4 Revision History
Changes from Revision H (March 2015) to Revision I Page
• Changed body size values in Device Information table ........................................................................................................ 1
Changes from Revision G (November 2007) to Revision H Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
• Changed specification values in Timing Requirements table ................................................................................................ 6
2 Submit Documentation Feedback Copyright © 2002–2015, Texas Instruments Incorporated
Product Folder Links: TMP100 TMP101
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