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TMP103AYFFT 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
温度传感器
封装:
UFBGA-4
描述:
TEXAS INSTRUMENTS TMP103AYFFT 温度传感器芯片, 数字式, ± 1°C, -40 °C, 125 °C, DSBGA, 4 引脚
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装信息在P3
导航目录
TMP103AYFFT数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN#20160610005A
PCN Number:
20160610005A
PCN Date:
Sept. 14, 2016
Title:
Qualify 2mm pitch Carrier Tape for select DSBGA and uSIP Devices
Customer Contact:
PCN Manager
Dept:
Quality Services
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Revision A is to update the description of change to provide additional information on the 2mm
carrier pitch packing method differentiating this from the 4mm pitch carrier tape. We apologize for
any inconvenience this may have caused.
Texas Instruments is pleased to announce the qualification of 2mm pitch carrier tape for select
DSBGA and uSIP Devices. These devices are currently shipped in 4mm pitch carrier tape. Carrier
tape design summary as follows:
Current Design:
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