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TMP112AIDRLT 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
温度传感器
封装:
SOT-563-6
描述:
TEXAS INSTRUMENTS TMP112AIDRLT 温度传感器芯片, 数字式, -0.5°C 至+0.3°C, -55 °C, +150 °C, SOT-563, 6 引脚
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3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P12Hot
典型应用电路图在P25P26
原理图在P1P9P10
封装尺寸在P29P31P32
标记信息在P29
封装信息在P28P29P30P31P32
技术参数、封装参数在P4P22P23
应用领域在P1P26
电气规格在P5
导航目录
TMP112AIDRLT数据手册
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TMP112
SBOS473E –MARCH 2009–REVISED DECEMBER 2015
www.ti.com
Table of Contents
7.4 Device Functional Modes........................................ 17
1 Features.................................................................. 1
7.5 Programming .......................................................... 18
2 Applications ........................................................... 1
8 Application and Implementation ........................ 22
3 Description............................................................. 1
8.1 Application Information............................................ 22
4 Revision History..................................................... 2
8.2 Typical Application ................................................. 25
5 Pin Configuration and Functions......................... 3
9 Power Supply Recommendations...................... 26
6 Specifications......................................................... 4
10 Layout................................................................... 27
6.1 Absolute Maximum Ratings ..................................... 4
10.1 Layout Guidelines ................................................. 27
6.2 ESD Ratings.............................................................. 4
10.2 Layout Example .................................................... 27
6.3 Recommended Operating Conditions....................... 4
11 Device and Documentation Support ................. 28
6.4 Thermal Information.................................................. 4
11.1 Documentation Support ....................................... 28
6.5 Electrical Characteristics........................................... 5
11.2 Community Resources.......................................... 28
6.6 Timing Requirements................................................ 6
11.3 Trademarks........................................................... 28
6.7 Typical Characteristics.............................................. 7
11.4 Electrostatic Discharge Caution............................ 28
7 Detailed Description.............................................. 9
11.5 Glossary................................................................ 28
7.1 Overview................................................................... 9
12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram......................................... 9
Information........................................................... 28
7.3 Feature Description................................................. 10
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (April 2015) to Revision E Page
• Added TI Design .................................................................................................................................................................... 1
• Added NIST Features bullet .................................................................................................................................................. 1
• Added last paragraph to Description section ......................................................................................................................... 1
Changes from Revision C (October 2014) to Revision D Page
• Changed MIN, TYP, and MAX values for the Temperature Accuracy (temperature error) parameter.................................. 5
• Changed the frequency from 2.85 to 3.4 MHz in the POWER SUPPLY section of the Electrical Characteristics table ...... 5
• Changed the Temperature Error at 25°C graph in the Typical Characteristics section......................................................... 7
• Changed the Temperature Error vs Temperature graph in the Typical Characteristics section............................................ 7
Changes from Revision B (June 2009) to Revision C Page
• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 4
• Changed parameters in Timing Requirements ...................................................................................................................... 6
Changes from Revision A (March 2009) to Revision B Page
• Changed footnote 1 of Table 14 .......................................................................................................................................... 22
• Clarified Example 1; extended worst-case accuracy to be from –15°C to +50°C................................................................ 22
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