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TMP302CDRLT 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
温度传感器
封装:
SOT-553-6
描述:
TEXAS INSTRUMENTS TMP302CDRLT 温度传感器芯片, 漏极开路, ± 0.2°C, -40 °C, +125 °C, SOT-23, 6 引脚
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3D模型
符号图
焊盘图
引脚图
产品图
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TMP302CDRLT数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments Incorporated PCN# 20180529001.1
PCN Number:
20180529001.1
PCN Date:
May 30, 2018
Title:
Qualification of AIZU as an additional Wafer Fab Site option for select devices in
HPA07 Technology
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
Aug 30, 2018
Estimated Sample
Availability:
Date provided at
sample request.
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of its AIZU fabrication facility as an
additional Wafer Fab source for the selected devices listed in “Product Affected” section.
Current Sites
Additional Sites
Current
Fab Site
Process
Wafer
Diameter
Additional
Fab Site
Process
Wafer
Diameter
DP1DM5
HPA07
200mm
AIZU
HPA07
200mm
Qual details are provided in the Qual Data Section.
Reason for Change:
Continuity of Supply
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
Current
Chip Site
Chip Site Origin (20L)
Chip Site Country Code (21L)
Chip Site City
DP1DM5
DM5
USA
Dallas
New Fab Site
Chip Site
Chip Site Origin (20L)
Chip Site Country Code (21L)
Chip Site City
AIZU
CU2
JPN
Aizuwakamatsu-shi
Sample product shipping label (not actual product label)
Product Affected Group:
INA226AIDGSR
TMP302BDRLT
TMP302DDRLR
TMP435ADGST
INA226AIDGST
TMP302CDRLR
TMP302DDRLT
TMP302BDRLR
TMP302CDRLT
TMP435ADGSR
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