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TMP75AIDGKR 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
温度传感器
封装:
VSSOP-8
描述:
TEXAS INSTRUMENTS TMP75AIDGKR 芯片, 传感器, 温度, 1°C, VSSOP-8
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TMP75AIDGKR数据手册
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Texas Instruments, Inc. PCN# 20150420000
PCN Number:
20150420000
PCN Date:
04/22/2014
Title:
Datasheet update for TMP75/TMP175
Customer Contact:
PCN Manager
Dept:
Quality Services
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments Incorporated is announcing an information only notification etc.
The product datasheet(s) is being updated as summarized below.
The following change history provides further details.
The datasheet number will be changing.
Device Family
Change From:
Change To:
TMP75/TMP175
SBOS288J
SBOS288K
These changes may be reviewed at the datasheet links provided.
http://www.ti.com/product/tmp175
http://www.ti.com/product/tmp75
Reason for Change:
To more accurately reflect device characteristics.
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
No anticipated impact. This is a specification change announcement only. There are no changes
to the actual device.
Changes to product identification resulting from this PCN:
None.
Product Affected:
TMP175AID
TMP175AIDGKTG4
TMP75AIDG4
TMP75AIDGKTG4
TMP175AIDG4
TMP175AIDR
TMP75AIDGKR
TMP75AIDR
TMP175AIDGKR
TMP175AIDRG4
TMP75AIDGKRG4
TMP75AIDRG4
TMP175AIDGKT
TMP75AID
TMP75AIDGKT
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