Datasheet 搜索 > 温度传感器 > TI（德州仪器） > TMP75AIDR 数据手册 > TMP75AIDR 其他数据使用手册 4/34 页
器件3D模型￥ 0.755
TMP75AIDR 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
温度传感器
封装:
SOIC-8
描述:
TEXAS INSTRUMENTS TMP75AIDR 温度传感器芯片, 数字式, ± 0.5°C, -40 °C, +125 °C, SOIC, 8 引脚
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P19P20P21P22
原理图在P8P19
封装尺寸在P26P28P29
标记信息在P26P27
封装信息在P26P27P28P29
技术参数、封装参数在P4
应用领域在P19P20P21P22
电气规格在P5
导航目录
TMP75AIDR数据手册
Page:
of 34 Go
若手册格式错乱，请下载阅览PDF原文件
4
TMP275
ZHCSA58E –JUNE 2006–REVISED NOVEMBER 2015
www.ti.com.cn
Copyright © 2006–2015, Texas Instruments Incorporated
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Power supply, V+ 7 V
Input voltage
(2)
–0.5 7 V
Input current 10 mA
Operating temperature –55 127 °C
Junction temperature, T
J
max, 150 °C
Storage temperature, T
stg
–60 130 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±4000
VCharged device model (CDM), per JEDEC specification JESD22-C101, all pins
(2)
±1000
Machine Model (MM) ±300
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage 2.7 5.5 V
Operating free-air temperature, T
A
–40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.4 Thermal Information
THERMAL METRIC
(1)
TMP275
UNITD (SOIC) AND DGK (VSSOP)
8 PINS
R
θJA
Junction-to-ambient thermal resistance 120 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 66.7 °C/W
R
θJB
Junction-to-board thermal resistance 60.4 °C/W
ψ
JT
Junction-to-top characterization parameter 17.8 °C/W
ψ
JB
Junction-to-board characterization parameter 59.9 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A °C/W
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
