Datasheet 搜索 > DSP数字信号处理器 > TI（德州仪器） > TMS320C40GFL50 数据手册 > TMS320C40GFL50 其他数据使用手册 1/2 页
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TMS320C40GFL50 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
CPGA-325
描述:
数字信号处理器 DIGITAL SIGNAL PROCESSOR
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
TMS320C40GFL50数据手册
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of 2 Go
若手册格式错乱，请下载阅览PDF原文件
MECHANICAL DATA
MCPG013F – JANUARY 1995 – REVISED DECEMBER 2001
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
GF (S-CPGA-P325) CERAMIC PIN GRID ARRAY
4040035-2/F 11/01
1.879 (47,73)
1.841 (46,76)
SQ
TYP
0.050 (1,27) TYP
0.080 (2,03) TYP
0.150 (3,81)
0.145 (3,68)
0.200 (5,08)
DETAIL A
1.717 (43,61)
TYP
3533312925 2719 211715131197 23
1.683 (42,75)
AR
AN
AJ
AG
AE
AA
AC
AL
W
R
U
N
L
53
G
E
A
C
1
J
0.120 (3,05)
0.165 (4,19)
0.016 (0,41)
0.020 (0,51)
0.040 (1,02)
0.006 (0,152)
0.060 (1,52)
0.026 (0,660)
0.170 (4,32)
0.190 (4,83)
0.048 (1,22) DIA 4 Places
0.050 (1,27)
0.100 (2,54)
A1 Corner
Bottom View
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Index mark can appear on top or bottom, depending on package vendor.
D. Pins are located within 0.010 (0,25) diameter of true position relative to
each other at maximum material condition and within 0.030 (0,76) diameter
relative to the edge of the ceramic.
E. This package can be hermetically sealed with metal lids or with ceramic lids using glass frit.
F. The pins can be gold-plated or solder-dipped.
G. Package thickness of 0.165 (4,19) / 0.120 (3,05) includes package body and lid.
H. Falls within JEDEC MO-128AK
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