Datasheet 搜索 > DSP数字信号处理器 > TI（德州仪器） > TMS320C5517AZCH20 数据手册 > TMS320C5517AZCH20 其他数据使用手册 1/7 页
器件3D模型￥ 78.39
TMS320C5517AZCH20 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
LFBGA-196
描述:
TMS320C5517 低功耗数字信号处理器 196-NFBGA -10 to 70
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
电气规格在P1
导航目录
TMS320C5517AZCH20数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Inc. PCN#20160602000A
PCN Number:
20160602000A
PCN Date:
06/20/2016
Title:
BGA Tray Change
Customer Contact:
PCN Manager
Dept:
Quality Services
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Revision A is to remove select devices in the Product Affected Section (with strikethrough) and
highlighted in yellow. These devices were inadvertently added and not affected by this change.
Texas Instruments is pleased to announce the qualification of PEAK tray for the devices listed
under the Product Affected section. Tray comparison summary as follows:
Group 1 Device: 9x9mm BGA Tray
What
From
To
Stock #/Supplier
4204956-0001/OHKAWA
4209920-0001/KOSTAT
4222683-0001/PEAK
Matrix (Column x Rows)
10x26
10x26
Surface Resistivity, Ohms/Sq.
10⁵ to 10⁹
10⁵ to 10⁹
Raw Material
PPE / MPPO
MPPO
Tray Color
Black
Black
Temperature Rating
150 ⁰C
150 ⁰C
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