Datasheet 搜索 > DSP数字信号处理器 > TI（德州仪器） > TMS320C6416TBCLZ1 数据手册 > TMS320C6416TBCLZ1 其他数据使用手册 1/4 页
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TMS320C6416TBCLZ1 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
BFBGA-532
描述:
定点数字信号处理器 FIXED-POINT DIGITAL SIGNAL PROCESSORS
Pictures:
3D模型
符号图
焊盘图
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TMS320C6416TBCLZ1数据手册
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若手册格式错乱，请下载阅览PDF原文件
Texas Instruments, Incorporated PCN#20170331000B
PCN Number:
20170331000B
PCN Date:
Feb 12 2018
Title:
New 23x23 trays for Select BGA Devices
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
July 5 2017
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Revision B is to correct the thickness “to” value dimension in the below comparison table. The
correction is shown in bold highlight.
Texas Instruments is pleased to announce the qualification of a new improved tray for select
BGA devices in the list below. A comparison summary of the differences as follows:
23 x 23 BGA Tray Change
What
From
To
Stock #/Supplier
4212091/Daewan, 4212396/Kostat
4222079/Daewon
Weight
100/104 grams
169 grams
Thickness
7.62mm
12.9 12.19mm
Floor Design
“X”, Square
“X”
Pocket Design
“X”, Square
“X”
Design
4212091
4212396
4222079
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