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TMS320C6421ZDU7 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
BGA-376
描述:
定点数字信号处理器 376-BGA 0 to 90
Pictures:
3D模型
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TMS320C6421ZDU7数据手册
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Texas Instruments, Inc. PCN# 20150630001
PCN Number:
20150630001
PCN Date:
07/01/2015
Title:
Mold Package Eject Tool Design for 23x23mm PBGA Package
Customer Contact:
PCN Manager
Dept:
Quality Services
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of new ejector pin location for
23x23mm PBGA package. Ejector pin location change as follows:
Current
Proposed
Ejector pin location
Substrate side
Molded Package Body side
New Mold die w/
ejector pin mark
Old Mold die w/o
ejector pin
FROM TO
Ejector Pin Mark
Pin 1 indicator Pin 1 indicator
New Mold die w/
ejector pin mark
Old Mold die w/o
ejector pin
FROM TO
Ejector Pin Mark
Pin 1 indicator Pin 1 indicator
Reason for Change:
Improve Quality and Reliability
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
Eliminate assembly tool ejector pin contact with the package substrate surface that could result
in visible tool marks on the substrate and/or a broken substrate Cu trace.
Changes to product identification resulting from this PCN:
None
Product Affected:
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