Datasheet 搜索 > DSP数字信号处理器 > TI（德州仪器） > TMS320C6726BRFP266 数据手册 > TMS320C6726BRFP266 其他数据使用手册 6/7 页
器件3D模型￥ 110.998
TMS320C6726BRFP266 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
TQFP-144
描述:
TEXAS INSTRUMENTS TMS320C6726BRFP266 芯片, 数字信号处理器, 浮点型, 144-HTQFP
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TMS320C6726BRFP266数据手册
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Texas Instruments, Inc. PCN# 20140926000
Attributes
Qual Device:
TAS5631PHDR
Qual Device:
TLK2201BIRCP
Qual Device:
TUSB9260PVP
Qual Device:
TVP70025IPZPR
Qual Device:
TAS5707PHP
Qual Device:
TVP5145PFP
Assembly Site TAI TAI PHI TAI PHI TAI
Package Family HTQFP HVQFP HTQFP HTQFP HTQFP HTQFP
Flammability Rating UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0
RFAB MIHO6
DMOS5 ANAM
1833C05 33A12
LBC5X 33C10.34L
- C
A0 F
Nitride
Oxide/Nitride
Package Attributes
Qual Device:
TAS5631PHDR
Qual Device:
TLK2201BIRCP
Qual Device:
TUSB9260PVP
Qual Device:
TVP70025IPZPR
Qual Device:
TAS5707PHP
Qual Device:
TVP5145PFP
Assembly Site TAI TAI PHI TAI PHI TAI
Package Family HTQFP HVQFP HTQFP HTQFP HTQFP HTQFP
Package
Designator
PHD RCP PVP PZP PHP PFP
Package Size
(mils)
472.44 X 472.44 393.7 X 393.7 275.59 X 275.59 551.18 X 551.18 275.59 X 275.59 472.44 X 472.44
Body Thickness
(mils)
39.37 31.5 39.37 39.37 39.37 39.37
Pin Count 64 64 64 100 48 80
Lead Frame
Material
Cu Cu Cu Roughened Cu Roughened Cu Cu
Lead Finish NiPdAu NiPdAu NiPdAu NiPdAu NiPdAu NiPdAu
Lead Pitch (mils) 31.5 19.68 15.75 19.68 19.68 19.68
Mount Compound 4206201 4042504 4208458 4042504 4208458 4042504
Mold Compound 4211649 4211649 4211649 4211649 4211649 4211649
Bond Wire
Composition
Cu Cu Au Cu Cu Au
Bond Wire
Diameter (mils)
1.98 0.96 0.8 0.8 0.8; 1.98 0.96
Flammability Rating UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0 UL 94 V-0
Oxide/Nitride
Oxide/Nitride
Oxide/Nitride
Oxide/Nitride
Oxide/Nitride
Passivation
C
F
D
B
Die Revision
LBC5
25C10X4
C021
1833C05
DMOS5
ANAM
DMOS6
DMOS5
Wafer Fab Process
Wafer Fab Site
- QBS: Qual By Similarity
- Qual Device qualified at LEVEL4-260CG: D610A3BPYP225
- Qual Devices qualified at LEVEL3-260CG: 6964BDC0PAPG4, ADS58C20IPFP, SLK2511CPZP, TLK2201BIRCP,
TUSB9260PVP, TVP70025IPZPR, TAS5707PHP, TVP5145PFP, TAS5631PHDR
- Qual Device qualified at LEVEL2-260CG:DRV593VFP
- Devices contain multiple dies: TAS5707PHP, TVP5145PFP
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