Datasheet 搜索 > DSP数字信号处理器 > TI（德州仪器） > TMS320DM365ZCED30 数据手册 > TMS320DM365ZCED30 产品修订记录 1/5 页
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TMS320DM365ZCED30 产品修订记录 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
DSP数字信号处理器
封装:
NFBGA-338
描述:
TEXAS INSTRUMENTS TMS320DM365ZCED30 芯片, 视频处理器, 270MHZ, NFBGA-338
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TMS320DM365ZCED30数据手册
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Texas Instruments, Inc. PCN#20150915001
12500 TI Boulevard, MS 8640, Dallas, Texas 75243
PCN#20150915001
Qualification of 100% Cu wire bonding on select nfBGA Devices
Change Notification / Sample Request
Date: 9/21/2015
To: Newark/Farnell PCN
Dear Customer:
This is an announcement of a change to a device that is currently offered by Texas
Instruments. The details of this change are on the following pages.
We request you acknowledge receipt of this notification within 30 days of the date of this
notice. Lack of acknowledgement of this notice within 30 days constitutes acceptance of the
change. If you require samples or additional data to support your evaluation, please request
within 30 days.
The proposed first ship date is indicated on page 3 of this notification, unless customer
agreement has been reached on an earlier implementation of the change.
This notice does not change the end-of-life status of any product. Should product affected be
on a previously issued product withdrawal/discontinuance notice, this notification does not
extend the life of that product or change the life time buy offering/discontinuance plan.
For questions regarding this notice, contact your local Field Sales Representative or the PCN
Manager (PCN_ww_admin_team@list.ti.com).
Sincerely,
PCN Team
SC Business Services
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