Datasheet 搜索 > 32位控制器 > TI（德州仪器） > TMS320F28069UPFPS 数据手册 > TMS320F28069UPFPS 其他数据使用手册 1/5 页
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TMS320F28069UPFPS 其他数据使用手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
32位控制器
封装:
HTQFP-80
描述:
Piccolo微处理器 Piccolo Microcontrollers
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3D模型
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TMS320F28069UPFPS数据手册
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Texas Instruments, Inc. PCN#20140721003
PCN Number:
20140721003
PCN Date:
07/22/2014
Title:
Qualification of new BOM for select devices in QFP package
Customer Contact:
PCN Manager
Phone:
+1(214)480-6037
Dept:
Quality
Services
Proposed 1
st
Ship Date:
10/22/2014
Estimated Sample Availability:
Date provided
upon request
Change Type:
Assembly Site
Assembly Process
Assembly Materials
Design
Electrical Specification
Mechanical Specification
Test Site
Packing/Shipping/Labeling
Test Process
Wafer Bump Site
Wafer Bump Material
Wafer Bump Process
Wafer Fab Site
Wafer Fab Materials
Wafer Fab Process
Part number change
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of a new material set for the 3 groups
of devices listed below:
Group A will be converted to Cu wire only.
Group C will be converted to Cu wire as well as a new mold compound.
Change Group# A
Current
New
Bond Wire/Diameter
Au, 1.0 mil
Cu, 0.8 mil
Change Group# C
Current
New
Mold Compound
4205442
4073520
4211649
Bond Wire/Diameter
Au, 0.96 mil
Cu, 0.8 mil
Reason for Change:
Continuity of Supply.
1) To align with world technology trends and use wiring with enhanced mechanical and
electrical properties.
2) Maximize flexibility within our Assembly/Test production sites
3) Copper wire is easier to obtain and stock
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative):
None
Changes to product identification resulting from this PCN:
None
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